The TPD4S009 and TPD4S010 provide system level electrostatic discharge (ESD) solution for high-speed differential lines. These devices offer four ESD clamp circuits for dual pair differential lines. The TPD4S009 offers an optional VCC supply pin which can be connected to system supply plane. There is a blocking diode at the VCC pin to enable the Ioff feature for the TPD4S009. The TPD4S009 can handle live signal at the D+, D- pins when the VCC pin is connected to zero volt. The VCC pin allows all the internal circuit nodes of the TPD4S009 to be at known potential during start up time. However, connecting the optional VCC pin to board supply plane doesn't affect the system level ESD performance of the TPD4S009. The TPD4S010 does not offer the VCC pin.
The TPD4S009 is offered in DBV, DCK, DGS, and DRY packages. The TPDS4010 is offered in DQA package. The TPD4S009DRYR is the most space saving package option available for dual pair high-speed differential lines. The TPD4S009DGSR and TPD4S010DQAR offer flow-through board layout option to reduce signal glitches due to mismatch between the D+ and D- signal pair routing.
The monolithic silicon technology allows matching between the differential signal pairs. The excellent matching between the differential pair signal lines (0.05-pF line-line capacitance for the TPD4S009DRY) enables this device to operate at high-speed differential data rates (3-dB bandwidth > 4 GHz). The TPD4S009 and TPD4S010 are suitable for high-speed differential applications, such as high-definition multimedia interface (HDMI), low-voltage differential signaling (LVDS), serial advanced technology attachment (SATA), Ethernet, 1394 (FireWire)®, etc.
TPD4S009/TPD4S010 comply with IEC 61000-4-2 (Level 4) ESD.
TPD4S009/TPD4S010 are characterized for operation over the ambient air temperature range of –40°C to 85°C
| TPD4S009 | |
| Number of Channels | 4 |
| IEC 61000-4-2 Contact(+/- kV) | +/-8 |
| IEC 61000-4-2 Air-Gap(+/- kV) | +/-9 |
| IO Capacitance(Typ)(pF) | 0.8 |
| Differential Capacitance(pF) | 0.05 |
| Breakdown Voltage(Min)(V) | 9 |
| IO Leakage Current(nA) | 10 |
| Operating Temperature Range(°C) | -40 to 85 |
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| TPD4S009DBVR | ACTIVE | -40 to 85 | 0.29 | 1ku | SOT-23 (DBV) | 6 | 3000 | LARGE T&R | |
| TPD4S009DBVRG4 | ACTIVE | -40 to 85 | 0.29 | 1ku | SOT-23 (DBV) | 6 | 3000 | LARGE T&R | |
| TPD4S009DCKR | ACTIVE | -40 to 85 | 0.26 | 1ku | SC70 (DCK) | 6 | 3000 | LARGE T&R | |
| TPD4S009DCKRG4 | ACTIVE | -40 to 85 | 0.26 | 1ku | SC70 (DCK) | 6 | 3000 | LARGE T&R | |
| TPD4S009DGSR | ACTIVE | -40 to 85 | 0.33 | 1ku | MSOP (DGS) | 10 | 2500 | LARGE T&R | |
| TPD4S009DRYR | ACTIVE | -40 to 85 | 0.33 | 1ku | SON (DRY) | 6 | 5000 | LARGE T&R |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| TPD4S009DBVR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TPD4S009DBVR | TPD4S009DBVR |
| TPD4S009DBVRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TPD4S009DBVRG4 | TPD4S009DBVRG4 |
| TPD4S009DCKR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TPD4S009DCKR | TPD4S009DCKR |
| TPD4S009DCKRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TPD4S009DCKRG4 | TPD4S009DCKRG4 |
| TPD4S009DGSR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TPD4S009DGSR | TPD4S009DGSR |
| TPD4S009DRYR | TBD | Call TI | Call TI | TPD4S009DRYR | TPD4S009DRYR |
