TS3A44159 具有两个控件的 0.45Ω 四路 SPDT 模拟开关四通道 2:1 多路复用器/多路解复用器

TS3A44159
Configuration 4 X SPDT  
ron(max)(ohms) 0.45  
IL OFF(Max)(nA) N/A  
OFF Time(Max)(ns) 35  
ON Time(Max)(ns) 25  
Operating Temperature Range(°C) -40 to 85  
Pin/Package 16QFN, 16TSSOP, 16UQFN  
Approx. Price (US$) 0.37 | 1ku  
VCC(Min)(V) 4.3  
VCC(Max)(V) 4.3  
Voltage Nodes(V) 1.8, 2.5, 3.0, 3.3  
RON Flatness(Max)(Ohms) 0.1  
Technology Family TS  
ESD Rating(kV) 2kV HBM  
Bandwidth(MHz) 35  
Charge Injection(Max)(pC) 139  
RON Mis-match(Max)(Ohms) 0.07  
Voltage Node(V) 1.8, 2.5, 3.0, 3.3  
Vcc max(V) 4.3  
Vcc min(V) 1.65  
Number of Channels 4  
ICC(uA) 1.2  
Rating Catalog
TS3A44159 特性
TS3A44159 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TS3A44159PWR ACTIVE -40 to 85 0.37 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
TS3A44159PWRG4 ACTIVE -40 to 85 0.37 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
TS3A44159RGTR ACTIVE -40 to 85 0.37 | 1ku QFN (RGT) | 16 3000 | LARGE T&R  
TS3A44159RGTRG4 ACTIVE -40 to 85 0.37 | 1ku QFN (RGT) | 16 3000 | LARGE T&R  
TS3A44159RSVR ACTIVE -40 to 85 0.37 | 1ku UQFN (RSV) | 16 3000 | LARGE T&R  
TS3A44159RSVRG4 ACTIVE -40 to 85 0.37 | 1ku UQFN (RSV) | 16 3000 | LARGE T&R  
TS3A44159 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TS3A44159PWR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TS3A44159PWR TS3A44159PWR
TS3A44159PWRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TS3A44159PWRG4 TS3A44159PWRG4
TS3A44159RGTR TBD  Call TI  Call TI TS3A44159RGTR TS3A44159RGTR
TS3A44159RGTRG4 TBD  Call TI  Call TI TS3A44159RGTRG4 TS3A44159RGTRG4
TS3A44159RSVR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TS3A44159RSVR TS3A44159RSVR
TS3A44159RSVRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TS3A44159RSVRG4 TS3A44159RSVRG4
TS3A44159 应用技术支持与电子电路设计开发资源下载
  1. TS3A44159 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器信号开关产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. 防止模拟开关的额外功耗 (PDF 392 KB) (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)