TS3L100 具有低导通电阻的四路 SPDT 宽带网络开关
The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E)\ input. When E\ is low, the switch is enabled and the I port is connected to the Y port. When E\ is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.
This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down
| TS3L100 | |
| Voltage Node(V) | 3.3 |
| Vcc min(V) | 3 |
| Vcc max(V) | 3.6 |
| No. of Bits | 4 |
| ron(max)(ohms) | 15 |
| ICC(uA) | 3 |
| tpd max(ns) | 7.5 |
TS3L100 特性
- Wide Bandwidth (BW = 350 MHz Min)
- Low Differential Crosstalk (XTALK = –68 dB Typ)
- Low Power Consumption (ICC = 10 µA Max)
- Bidirectional Data Flow, With Near-Zero Propagation Delay
- Low ON-State Resistance (ron = 5
Typ)
- Rail-to-Rail Switching on Data I/O Ports (0 to VCC)
- VCC Operating Range From 3 V to 3.6 V
- Ioff Supports Partial-Power-Down Mode Operation
- Data and Control Inputs Have Undershoot Clamp Diodes
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
- Suitable for Both 10 Base-T/100 Base-T Signaling
TS3L100 芯片订购指南
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| TS3L100D | ACTIVE | 0 to 70 | 1.80 | 1ku | SOIC (D) | 16 | 40 | TUBE | TS3L100 |
| TS3L100DBQR | ACTIVE | 0 to 70 | 1.20 | 1ku | SSOP/QSOP (DBQ) | 16 | 2500 | LARGE T&R | TK100 |
| TS3L100DBQRE4 | ACTIVE | 0 to 70 | 1.20 | 1ku | SSOP/QSOP (DBQ) | 16 | 2500 | LARGE T&R | TK100 |
| TS3L100DBQRG4 | ACTIVE | 0 to 70 | 1.20 | 1ku | SSOP/QSOP (DBQ) | 16 | 2500 | LARGE T&R | TK100 |
| TS3L100DE4 | ACTIVE | 0 to 70 | 1.80 | 1ku | SOIC (D) | 16 | 40 | TUBE | TS3L100 |
| TS3L100DG4 | ACTIVE | 0 to 70 | 1.80 | 1ku | SOIC (D) | 16 | 40 | TUBE | TS3L100 |
| TS3L100DGVR | ACTIVE | 0 to 70 | 1.20 | 1ku | TVSOP (DGV) | 16 | 2000 | LARGE T&R | TK100 |
| TS3L100DGVRE4 | ACTIVE | 0 to 70 | 1.20 | 1ku | TVSOP (DGV) | 16 | 2000 | LARGE T&R | TK100 |
| TS3L100DGVRG4 | ACTIVE | 0 to 70 | 1.20 | 1ku | TVSOP (DGV) | 16 | 2000 | LARGE T&R | TK100 |
| TS3L100DR | ACTIVE | 0 to 70 | 1.20 | 1ku | SOIC (D) | 16 | 2500 | LARGE T&R | TS3L100 |
| TS3L100DRE4 | ACTIVE | 0 to 70 | 1.20 | 1ku | SOIC (D) | 16 | 2500 | LARGE T&R | TS3L100 |
| TS3L100DRG4 | ACTIVE | 0 to 70 | 1.20 | 1ku | SOIC (D) | 16 | 2500 | LARGE T&R | TS3L100 |
| TS3L100PW | ACTIVE | 0 to 70 | 1.80 | 1ku | TSSOP (PW) | 16 | 90 | TUBE | TK100 |
| TS3L100PWE4 | ACTIVE | 0 to 70 | 1.80 | 1ku | TSSOP (PW) | 16 | 90 | TUBE | TK100 |
| TS3L100PWG4 | ACTIVE | 0 to 70 | 1.80 | 1ku | TSSOP (PW) | 16 | 90 | TUBE | TK100 |
| TS3L100PWR | ACTIVE | 0 to 70 | 1.20 | 1ku | TSSOP (PW) | 16 | 2000 | LARGE T&R | TK100 |
| TS3L100PWRE4 | ACTIVE | 0 to 70 | 1.20 | 1ku | TSSOP (PW) | 16 | 2000 | LARGE T&R | TK100 |
| TS3L100PWRG4 | ACTIVE | 0 to 70 | 1.20 | 1ku | TSSOP (PW) | 16 | 2000 | LARGE T&R | TK100 |
| TS3L100RGYR | ACTIVE | 0 to 70 | 1.20 | 1ku | VQFN (RGY) | 16 | 3000 | LARGE T&R | TK100 |
| TS3L100RGYRG4 | ACTIVE | 0 to 70 | 1.20 | 1ku | VQFN (RGY) | 16 | 3000 | LARGE T&R | TK100 |
TS3L100 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| TS3L100D | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100D | TS3L100D |
| TS3L100DBQR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | TS3L100DBQR | TS3L100DBQR |
| TS3L100DBQRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | TS3L100DBQRE4 | TS3L100DBQRE4 |
| TS3L100DBQRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | TS3L100DBQRG4 | TS3L100DBQRG4 |
| TS3L100DE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100DE4 | TS3L100DE4 |
| TS3L100DG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100DG4 | TS3L100DG4 |
| TS3L100DGVR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100DGVR | TS3L100DGVR |
| TS3L100DGVRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100DGVRE4 | TS3L100DGVRE4 |
| TS3L100DGVRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100DGVRG4 | TS3L100DGVRG4 |
| TS3L100DR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100DR | TS3L100DR |
| TS3L100DRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100DRE4 | TS3L100DRE4 |
| TS3L100DRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100DRG4 | TS3L100DRG4 |
| TS3L100PW | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100PW | TS3L100PW |
| TS3L100PWE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100PWE4 | TS3L100PWE4 |
| TS3L100PWG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100PWG4 | TS3L100PWG4 |
| TS3L100PWR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100PWR | TS3L100PWR |
| TS3L100PWRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100PWRE4 | TS3L100PWRE4 |
| TS3L100PWRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3L100PWRG4 | TS3L100PWRG4 |
| TS3L100RGYR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | TS3L100RGYR | TS3L100RGYR |
| TS3L100RGYRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | TS3L100RGYRG4 | TS3L100RGYRG4 |
TS3L100 应用技术支持与电子电路设计开发资源下载
- TS3L100 数据资料 dataSheet 下载.PDF
- TI 德州仪器信号开关产品选型与价格 . xls
- Logic Guide 2009 (PDF 4263 KB)
- 防止模拟开关的额外功耗 (PDF 392 KB) (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)
