ULQ2003A-Q1 汽车类高电压、大电流达林顿晶体管阵列
The ULQ2003A and ULQ2004A are high-voltage high-current Darlington transistor arrays. Each consists of seven npn Darlington pairs that feature high-voltage outputs with common-cathode clamp diodes for switching inductive loads. The collector-current rating of a single Darlington pair is 500 mA. The Darlington pairs can be paralleled for higher current capability. Applications include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and logic buffers.
The ULQ2003A has a 2.7-k
series base resistor for each Darlington pair, for operation directly with TTL or 5-V CMOS devices. The ULQ2004A has a 10.5-kseries base resistor to allow operation directly from CMOS devices that use supply voltages of 6 V to 15 V
|
ULQ2003A-Q1 |
| Output Voltage(Max)(V) |
50 |
| Switching Voltage(Max)(V) |
50 |
| Peak Output Current(mA) |
500 |
| Drivers Per Package |
7 |
| Input Compatibility |
CMOS, TTL |
| Delay Time(Typ)(ns) |
1000 |
| Operating Temperature Range(�C) |
-40 to 105,-40 to 125 |
| Pin/Package |
16SOIC, 16TSSOP |
| Approx. Price (US$) |
0.24 | 1ku |
| Rating |
Automotive |
ULQ2003A-Q1 特性
- Qualified for Automotive Applications
- ESD Protection Exceeds 200 V Using
Machine Model (C = 200 pF, R = 0)
- 500-mA-Rated Collector Current (Single Output)
- High-Voltage Outputs: 50 V
- Output Clamp Diodes
- Inputs Compatible With Various Types of Logic
- Relay-Driver Applications
ULQ2003A-Q1 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| ULQ2003AQDRQ1 |
ACTIVE |
-40 to 125 |
0.25 | 1ku |
SOIC (D) | 16 |
2500 |
|
| ULQ2003ATDG4Q1 |
ACTIVE |
-40 to 105 |
0.29 | 1ku |
SOIC (D) | 16 |
40 |
|
| ULQ2003ATDQ1 |
ACTIVE |
-40 to 105 |
0.29 | 1ku |
SOIC (D) | 16 |
40 |
|
| ULQ2003ATDRG4Q1 |
ACTIVE |
-40 to 105 |
0.24 | 1ku |
SOIC (D) | 16 |
2500 |
|
| ULQ2003ATDRQ1 |
ACTIVE |
-40 to 105 |
0.24 | 1ku |
SOIC (D) | 16 |
2500 |
|
| ULQ2003ATPWRQ1 |
ACTIVE |
-40 to 105 |
0.24 | 1ku |
TSSOP (PW) | 16 |
2500 | LARGE T&R |
|
ULQ2003A-Q1 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| ULQ2003AQDRQ1 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
ULQ2003AQDRQ1 |
ULQ2003AQDRQ1 |
| ULQ2003ATDG4Q1 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
ULQ2003ATDG4Q1 |
ULQ2003ATDG4Q1 |
| ULQ2003ATDQ1 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
ULQ2003ATDQ1 |
ULQ2003ATDQ1 |
| ULQ2003ATDRG4Q1 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
ULQ2003ATDRG4Q1 |
ULQ2003ATDRG4Q1 |
| ULQ2003ATDRQ1 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
ULQ2003ATDRQ1 |
ULQ2003ATDRQ1 |
| ULQ2003ATPWRQ1 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
ULQ2003ATPWRQ1 |
ULQ2003ATPWRQ1 |
ULQ2003A-Q1 应用技术支持与电子电路设计开发资源下载
- ULQ2003A-Q1 数据资料 dataSheet 下载.PDF
- TI 德州仪器其它接口选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
