技术特性
- Usable bandwidth 10 MHz
- High attenuation
- No impedance matching required for operation at 200 Ohm
- Balanced operation
- Ceramic Surface Mount Package (SMP)
- Small size
技术指标
频率(MHz) |
带宽 (MHz) |
插入损耗 (dB) |
操作模式 |
封装(mm) |
1086 |
10 |
5.0 max |
BAL |
3.0x3.0 |
855964 产品实物图
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应用领域 APPLICATION
订购信息 Ordering Information
封装外形Package Outline
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