TQM756014 带双工器的CDMA & WCDMA / HSUPA 功率放大器模块

The TQM756014 is fully matched Power Amplifier Module designed for use in CDMA BC15 (AWS), WCDMA (Bands 4) and LTE handsets. Its compact 3x3mm package including a coupler and built-in voltage regulator makes it ideal for today’s extremely small data enabled phones. Its RF performance meets the stringent linearity requirements for multi-mode operation. The TQM756014 is designed on TriQuint’s GaAs BiHEMT technology with CuFlip® assembly offering state of the art reliability, temperature stability and ruggedness. The 3-Gain state PA die operates in LPM, MPM and HPM to maximize talk time over the entire range of operating conditions. To simplify the cost/time of calibration while in production the TQM776011 can be used in 1-bit operation; either LPM/HPM with only 4mA of IcQ up to +13dBm in LPM, or MPM/HPM with 9mA of IcQ up to +17dBm in MPM.

技术特性
  • GaAs BiHEMT / CuFlip® PA Technology
  • Typical Quiescent Current values: LPM: 4 mA MPM: 9 mA HPM: 90 mA
  • Excellent Linearity in all modes
  • Integrated high performance coupler
  • Excellent Phase Discontinuity
  • Built-in voltage regulator functionality eliminating any external switch circuitry
  • Small 10-pin, 3x3mm module
  • Lead-free 260°C / RoHS / Halogen-free
  • Full ESD protection
订购信息 Ordering Information
  • TQM756014
技术指标
尺寸 频段 特点
3.0 x 3.0 x 0.9 AWS / Band 4 2-Bit (Hi / Med / Lo Power Modes)
应用领域 APPLICATION
  • WCDMA B4 Handsets
  • CDMA2000 BC15 (AWS) Applications
  • HSUPA, HSDPA, HSPA+ Applications
  • LTE-Compatible Applications
功能框图 Functional Block Diagram

TQM756014 功能框图

应用技术支持与电子电路设计开发资源下载 版本信息 大小
TQM756014 数据资料DataSheet下载:pdf Rev.V2 2 页