CY7C1460AV25-167BZC

数据手册DataSheet 下载

CY7C1460AV25, CY7C1462AV25:36-Mbit (1 M × 36/2 M × 18) Pipelined SRAM with NoBL™ Architecture(pdf, 772.78 KB)
数据手册更新日期:October 06, 2015

CY7C1460AV25-167BZC
架构NoBL, Pipeline
合格汽车
突发长度(字)0
密度 (Kb)36864
Density (Mb)36
频率 (MHz)167
最高工作温度 (°C)70
Max. Operating VCCQ (V)2.60
最高工作电压 (V)2.63
最低工作温度 (°C)0
Min. Operating VCCQ (V)2.40
最低工作电压 (V)2.38
组织 (X x Y)1Mb x 36
温度分类商用
封装与供应信息 Packaging/Ordering
工具包 FBGA
No. of Pins165
Package Dimensions669 L x 1.4 H x 590 W (Mils)
Package Weight629.20 (mgs)
Package Cross Section Drawing 下载
Package CarrierTRAY
Standard Pack Quantity105
Minimum Order Quantity (MOQ)105
Order Increment105
Estimated Lead Time (days)35
HTS Code8542.32.0040
ECCN(B.2.A.)
ECCN Suball3A991
品质与环保 Quality and RoHS
Moisture Sensitivity Level (MSL)3
Peak Reflow Temp. (°C)220 ()   Cypress Reflow Profile
符合有害物质限制 (RoHS) 标准N   Print RoHS Certificate of Compliance
无铅
Lead/Ball FinishSn/Pb
Marking   Cypress Marking Format
封装材料声明
RoHS Analysis Certificates (CoA) for Direct Materials
    应用笔记 (3)
    文件标题 下载
    AN1090 - NoBL™:The Fast SRAM Architecture
    AN4011 - Choosing The Right Cypress Synchronous SRAM
    AN4017 - 了解温度规范:简介
    模型 (4)
    文件标题 下载
    CY7C1460AV25 - IBIS
    CY7C1460AV25 - VHDL
    CY7C1460AV25-Verilog
    CY7C1460AV25-BSDL
    产品变更通知 (PCN) (9)
    文件标题 下载
    PCN050667
    PCN061123
    PCN050862
    PCN125145
    PCN155371
    PCN152502
    PCN125157
    PCN125175
    Product Information Notice (PIN) (1)
    文件标题 下载
    PIN145277
    Models
    CY7C1460AV25.zip English , 11/13/2008
    1460AV25.zip English , 11/13/2008
    CY7C1460AV25-IBIS.zip English , 10/19/2015
    CY7C1460AV25-VHDL.zip English , 04/07/2015
    Product Change Notice
    PCN061123 English , 08/14/2008
    PCN061127 English , 08/14/2008
    Qualification Reports
    QTP# 044501: 165-BALL FINE PITCH BALL GRID ARRAY (FBGA) (15 X 17 X 1.4MM) MSL3, 220C SOLDER REFLOW ASE-TAIWAN (G) English , 09/20/2016
    QTP# 013508: 272 PLASTIC BALL GRID ARRAY (PBGA) 27MM X 27MM MSL3 ASE- TAIWAN (G) English , 09/20/2016
    QTP# 062504: <165-BALL FINE PITCH BALL GRID ARRAY (FBGA) (13 X 15 X 1.4MM) (1.0MIL WIRE) MSL3, 220C SOLDER REFLOW CML-RA (AUTOLINE) English , 09/20/2016
    QTP# 052210: ALL PLASTIC BALL GRID ARRAY PACKAGE (PBGA) SNPB, MSL 3, 220C SOLDER REFLOW ASE-TAIWAN English , 09/20/2016