CY8C29466-24PVXIT
数据手册DataSheet 下载
CY8C29466, CY8C29566, CY8C29666, CY8C29866:PSoC® 可编程片上系统™(pdf, 1.72 MB)
数据手册更新日期：January 13, 2016
CY8C29466-24PVXIT
| Development Kit | CY3215-DK, CY3211-28SSOP |
|---|---|
| 合格汽车 | 否 |
| Boost Converter (V) | 0 |
| CPU Core | M8C |
| CapSense | 否 |
| 专用模数转换器（编号_最大分辨率 @ 采样速率） | 无 |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | 无 |
| 闪存 (KB) | 32 |
| LCD Direct Drive | 否 |
| 最高工作频率 (MHz) | 24 |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 5.25 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 3.00 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 4 |
| No. of Dedicated UART | 4 |
| GPIO 编号 | 24 |
| 可编程模拟模块编号 | 12 |
| 可编程数字模块编号 | 16 |
| SRAM (KB) | 2 |
| USB (Type) | 无 |
封装与供应信息 Packaging/Ordering
| 工具包 | SSOP |
|---|---|
| No. of Pins | 28 |
| Package Dimensions | 408 L x 0 H x 210 W (Mils) |
| Package Weight | 229.90 (mgs) |
| Package Cross Section Drawing | 下载 |
| Package Carrier | REEL |
| Package Carrier Drawing / Orientation | , , Reel Drawing；Tape Drawing；Package Orientation |
| Standard Pack Quantity | 1000 |
| Minimum Order Quantity (MOQ) | 1000 |
| Order Increment | 1000 |
| Estimated Lead Time (days) | 21 |
| HTS Code | 8542.31.0000 |
| ECCN | 无 |
| ECCN Suball | EAR99 |
品质与环保 Quality and RoHS
| Moisture Sensitivity Level (MSL) | 3 |
|---|---|
| Peak Reflow Temp. (°C) | 260 () Cypress Reflow Profile |
| 符合有害物质限制 (RoHS) 标准 | Y Print RoHS Certificate of Compliance |
| 无铅 | 是 |
| Lead/Ball Finish | Ni/Pd/Au, Pure Sn |
| Marking | Cypress Marking Format |
封装材料声明
- 28L - SSOP Pb-Free Package Material Declaration Datasheet Last Update: 2016 年 2 月 04 日
IPC 1752 材料成分声明
- IPC-1752-2_V1.1_SSOP 28_CML_NIPDAU Last Update: 2014 年 6 月 19 日
- IPC-1752-2_V1.1_SSOP 28_OSET_PURE SN Last Update: 2014 年 6 月 19 日
RoHS 分析证书 (CoA)
- PACKAGE ROHS ANALYSIS REPORT - SSOP (SP 20, 28) USING MOLD COMPOUND CEL9220HF, ADHESIVE 8340, PURE SN - OSE TAIWAN ASSEMBLY Last Update: 2012 年 7 月 04 日
- PACKAGE ROHS ANALYSIS REPORT - SSOP (SP20,28,48,56) QSOP (SQ20,24) SOIC (SZ18,24) TSOP (ZT32) USING MOLD COMPOUND KEG3000DA, ADHESIVE QMI509, NIPDAU - CML ASSEMBLY Last Update: 2012 年 7 月 04 日
RoHS Analysis Certificates (CoA) for Direct Materials
Package Qualification Report
- QTP NO 063711 20/28-LEAD (SSOP) (209MILS), NIPDAU, MSL3, 260C, CML-RA.pdf Last Update: 2015 年 8 月 07 日
- Qtp 30604 28 lead Ssop (209mils) 100% Sn Msl3, 260c Solder Reflow Ose Taiwan (t).pdf Last Update: 2015 年 8 月 07 日
- QTP 63503 ≤ 28-Lead SSOP (209 mils) NiPdAu, MSL3,260C Solder Reflow Amkor-Philippines (M).pdf Last Update: 2015 年 8 月 07 日
Device Qualification Reports
- QTP# 072502:PSOC1 HYDRA DEVICE FAMILY, S4AD-5 TECHNOLOGY, FAB5 Last Update: 2014 年 2 月 20 日
技术参考手册 (1)
| 文件标题 | 下载 |
| PSoC® 1 ISSP Programming Specifications - CY8C21x45, CY8C22x45, CY8C24x94, CY8C28xxx, CY8C29x66, CY8CTST120, CY8CTMA120, CY8CTMG120, CY7C64215 |
|
