CYP15G0201DXB-BBXI
数据手册DataSheet 下载
CYP15G0201DXB:Dual-channel HOTLink II™ Transceiver(pdf, 1.14 MB)
数据手册更新日期：August 28, 2015
CYP15G0201DXB-BBXI
| 8B / 10B ENDEC | 否 |
|---|---|
| 合格汽车 | 否 |
| Functions | Transceiver |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 3.45 |
| Max. Speed (Mbps) | 1500 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 3.15 |
| Min. Speed (Mbps) | 200 |
| No. of Channels | 2 |
| Standard | Fibre Channel / ESCON / GE / DVBASI |
封装与供应信息 Packaging/Ordering
| 工具包 | BGA |
|---|---|
| No. of Pins | 196 |
| Package Dimensions | 590 L x 1.4 H x 590 W (Mils) |
| Package Weight | 615.51 (mgs) |
| Package Cross Section Drawing | 下载 |
| Package Carrier | TRAY |
| Package Carrier Drawing / Orientation | , Drawing；Package Orientation |
| Standard Pack Quantity | 126 |
| Minimum Order Quantity (MOQ) | 126 |
| Order Increment | 126 |
| Estimated Lead Time (days) | 42 |
| HTS Code | 8542.39.0000 |
| ECCN | B.1 |
| ECCN Suball | 5A991 |
品质与环保 Quality and RoHS
| Moisture Sensitivity Level (MSL) | 5 |
|---|---|
| Peak Reflow Temp. (°C) | 260 () Cypress Reflow Profile |
| 符合有害物质限制 (RoHS) 标准 | Y Print RoHS Certificate of Compliance |
| 无铅 | 是 |
| Lead/Ball Finish | Sn/Ag/Cu |
| Marking | Cypress Marking Format |
封装材料声明
- 196 - FBGA 15X15X1.5MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET (PMDD) Last Update: 2013 年 7 月 25 日
RoHS 分析证书 (CoA)
- PACKAGE ROHS ANALYSIS REPORT - BGA (BK/BP 36, 42, 48, 96) (BW 96,100,119,144,165,200,000,000,000,000) USING MOLD COMPOUND KEG2270, ADHESIVE 2025D, SAC405 - ASE TAIWAN ASSEMBLY Last Update: 2012 年 7 月 04 日
RoHS Analysis Certificates (CoA) for Direct Materials
Package Qualification Report
- QTP 51708 209 Ball Fine Pitch Ball Grid Array (FBGA) (14 x 22 x 1.76mm) Pb-Free, MSL3, 260C Solder Reflow ASE-Taiwan (G).pdf Last Update: 2015 年 8 月 07 日
应用笔记 (22)
| 文件标题 | 下载 |
| AN4047 - Crosstalk Analysis of the Quad Independent Channel HOTLink II™ Device | |
| AN1160 - Hotlink® CY7B923/CY7B933 to Hotlink II™ Migration |
|
| AN1038 - Upgrade Your TAXI-275 with HOTLink® |
|
| AN1130 - Interfacing the CY7B923 and CY7B933 (HOTLink®) to Clocked FIFOs | |
| AN1089 - Parallel Cyclic Redundancy Check (CRC) for HOTLink® |
|
| AN1047 - Understanding Bit-Error-Rate with HOTLink® |
|
| AN1057 - TAXI™ to Cypress CY7C9689A Hotlink® Transceiver Conversion Series:1.System Parallel Interface | |
| AN17006 - High Speed Serial Simulation with HOTLink II™ |
|
| AN35159 - TAXI™ to Cypress CY7C9689 HOTLink® Transceiver Conversion Series Two-Serial Interface | |
| AN1161 - HOTLink® Jitter Characteristics |
|
| AN1162 - HOTLink® Design Considerations |
|
| AN1055 - Termination and Biasing of HOTLink II™ High-Speed Serial I/O | |
| AN1077 - Replacing Wire with Inexpensive Plastic Fiber Solutions | |
| AN1027 - Using High-Speed Serial Links to Supplement Parallel Data Bus | |
| AN067 - Configuring the HOTLink II™ CYP15G0403DXB Device for Multiple Protocols | |
| AN014 - Channel Bonding with HOTLink II Transceiver |
|
| AN080 - Interfacing the Hotlink II™ Transceiver with the 3.3 V Gennum GS1524 Equalizer and GS1528 Cable Driver for Digital Video | |
| AN060 - Frequently Asked Questions about the CYP(V)15G0403DXB Device | |
| AN1184 - Frequently Asked Questions About HOTLink® |
|
| AN1025 - Using HOTLink® with Long Copper Cables |
|
| AN1032 - Using Decoupling Capacitors |
|
| AN027 - Power Consumption of HOTLink II™ Family of Devices |
|
开发套件/板 (1)
| 文件标题 | 下载 |
| CYV15G0404DX-EVAL |
|
软件和驱动程序 (2)
| 文件标题 | 下载 |
| Cypress HOTLink II™ Power Estimation GUI |
|
| CYV15G0101DXB Video Evaluation Board Software |
|
模型 (4)
| 文件标题 | 下载 |
| CYP15G0201DXB-VHDL |
|
| CYP15G0201DXB-Verilog |
|
| CYP15G0201DXB-BSDL |
|
| HOTLink II - IBIS |
|
产品变更通知 (PCN) (5)
| 文件标题 | 下载 |
| PCN050669 |
|
| PCN050862 |
|
| PCN125145 |
|
| PCN125157 |
|
| PCN125175 |
|
Product Information Notice (PIN) (1)
| 文件标题 | 下载 |
| PIN145277 |
|
RoHS Analysis Certificates (CoA) for Direct Materials (1)
| 文件标题 | 下载 |
- CYP15G0201DXB: Dual-channel HOTLink II Transceiver Datasheet.pdf English , 01/05/2017
- CY2544, CY2546, CY2548: Quad PLL Programmable Clock Generator with Spread Spectrum Datasheet.pdf English , 01/05/2017
- QTP 51708 209 Ball Fine Pitch Ball Grid Array (FBGA) (14 x 22 x 1.76mm) Pb-Free, MSL3, 260C Solder Reflow ASE-Taiwan (G).pdf English , 08/07/2015
- QTP 130703 SOIC16LD (300Mils) S, Ni/PdAu, Au Wire, MSL3, 260°C Reflow, Amkor Philippines (M).pdf English , 08/07/2015
- QTP#125201 SSOP 48/56LD (300MILS) NIPDAU, 100% COPPER(CU) WIRE, MSL3 260C REFLOW CML-RA.pdf English , 08/07/2015
- QTP#124201 16-LEAD COL (CHIP ON LEAD) (3 X 3 X 0.6 MM) NIPDAU-AG, MSL 3, 260C REFLOW,CML- RA.pdf English , 08/07/2015
- CYP15G0201DXB_VHDL.zip English , 11/13/2008
- CYP15G0201DXB_VLOG.zip English , 11/13/2008
- cyp15g0201DXB_bsdl.zip English , 11/13/2008
