CY7C1051DV33-10BAXIT
CY7C1051DV33-10BAXIT| Automotive Qualified | N |
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| Density (Kb) | 8192 |
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| Frequency (MHz) | N/A |
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| Max. Operating Temp. (°C) | 85 |
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| Max. Operating VCCQ (V) | 3.60 |
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| Max. Operating Voltage (V) | 3.60 |
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| Min. Operating Temp. (°C) | -40 |
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| Min. Operating VCCQ (V) | 3.00 |
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| Min. Operating Voltage (V) | 3.00 |
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| Organization (X x Y) | 512K x 16 |
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| Part Family | Async Fast SRAMs |
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| Speed (ns) | 10 |
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| Tape & Reel | Y |
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| Temp. Classification | Industrial |
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Pricing & Inventory Availability| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|
| $51.76 | $42.22 | $39.84 | $37.46 | $36.77 | $35.75 |
- QTP 52502 48-Ball FBGA (Stacked Die) (8 x 9.5 x 1.2mm) Pb-Free, MSL5, 260C Reflow ASE-Taiwan.pdf English , 08/07/2015
- QTP 33105 48-ball Fine Pitch Ball Grid Array (FBGA) (8 x 9.5 x 1.0mm & 6 x 8 x 1.0mm) MSL3, Pb-Free, 260C Reflow ASE-Taiwan (G).pdf English , 08/07/2015
- QTP120406 32L STSOP, 32L/48L TSOP, AND 32L/44L TSOP II PACKAGES NIPDAU/PURE SN, 100% CU WIRE MSL3, 260C REFLOW OSE(T) - TAIWAN.pdf English , 08/07/2015
- QTP 120605 8L/16L/20L/24L/28L TSSOP PACKAGES 173MILS, NIPDAU/ PURE SN, 100% CU WIRE MSL3, 260C REFLOW OSE(T) - TAIWAN.pdf English , 08/07/2015
- QTP 42602 48-Ball Fine Pitch Ball Grid Array (FBGA) (7 x 8 x 1.2mm) MSL3, 260C Solder Reflow CML-RA (Autoline).pdf English , 08/07/2015
- 51-85193 English , 06/19/2014
- 51-85145 English , 06/19/2014
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- PACKAGE OUTLINE, 18L WINDOWED CERDIP .875X.245X.140 INCHES W4 English , 06/19/2014
- PACKAGE OUTLINE, 28L SQUARE LCC 0.45X0.45X0.071 IN. L28S English , 06/19/2014
- PACKAGE OUTLINE, 20L CERDIP .970X.310X.140 INCHES D20.3 English , 06/19/2014
- PACKAGE OUTLINE, 165LD FBGA 15X17X1.40MM (0.50 BALL DIAMETER) English , 06/19/2014
- PACKAGE OUTLINE, 16L CERDIP .745X.245X.140 INCHES D16.3 English , 06/19/2014
