FM22LD16-55-BG
FM22LD16-55-BG| Development Kit | No |
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| Automotive Qualified | N |
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| Density (Kb) | 4096 |
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| Frequency (MHz) | N/A |
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| Interface | Parallel |
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| Max. Operating Temp. (°C) | 85 |
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| Max. Operating VCCQ (V) | 3.60 |
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| Max. Operating Voltage (V) | 3.60 |
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| Min. Operating Temp. (°C) | -40 |
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| Min. Operating VCCQ (V) | 2.70 |
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| Min. Operating Voltage (V) | 2.70 |
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| Organization (X x Y) | 256Kb x 16 |
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| Part Family | Parallel FRAM |
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| Speed (ns) | 55 |
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| Tape & Reel | N |
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| Temp. Classification | Industrial |
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Pricing & Inventory Availability| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|
| $46.93 | $41.99 | $37.79 | $33.35 | $32.36 | $31.12 |
- QTP# 162409: CML-PHILIPPINES BURN-IN AND TEST SITES FOR FM22L16 4-MBIT (256K x16) F-RAM DEVICE FAMILY.pdf English , 01/30/2017
- QTP #154404: 64KB, 16KB AND 4KB F-RAM MEMORY PRODUCT QUALIFICATION, 130NM TECHNOLOGY, TI 300MM WAFER FAB DMOS 6.pdf English , 01/26/2017
- QTP #154906: 64KB, 16KB AND 4KB F-RAM MEMORY AUTOMOTIVE PRODUCT QUALIFICATION, 130NM TECHNOLOGY, TI 300MM WAFER FAB DMOS 6.pdf English , 01/26/2017
- QTP #143905: 1MB AND 2MB F-RAM MEMORY PRODUCT QUALIFICATION, 130NM TECHNOLOGY, TI 300MM WAFER FAB DMOS 6.pdf English , 01/26/2017
- QTP #D20191: BCM43242, Single Chip IEEE 802.11 a/b/g/n 2x2 MAC/Baseband/Radio with Integrated Bluetooth 4.0 + HS English , 01/26/2017
