BSM50GB60DLC

Our well-known  34 mm 600V dual IGBT modules are the right choice for your design.

ParametricBSM50GB60DLC
ConfigurationDual
IC(nom) / IF(nom)50.0A
VCE(sat) (Tvj=25°C typ)1.95V
VF (Tvj=25°C typ)1.25V
Housing34 mm
Sales Product NameBSM50GB60DLC
OPNBSM50GB60DLCHOSA1
Product Statusnot for new design
Package NameAG-34MM-1
Completely lead freeyes
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Superior solution for frequency controlled inverter drives
  • UL/CSA Certification with UL1557 E83336
  • Operating temperature up to 150 °C
  • Optimized switching characteristic like softness and reduced switching losses
  • Existing packages with higher current capability
  • RoHS compliant
Benefits:
  • Flexibility
  • Optimal electrical performance
  • Highest reliability
Benefits:
  • Flexibility
  • Optimal electrical performance
  • Highest reliability
功能框图
Data Sheet
TitleSizeDateVersion
BSM50GB60DLC,EN/DE124 KB16 八月 200701_00
Product Brochure
TitleSizeDateVersion
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
模块的评估驱动板；CN2.3 MB25 十一月 2013
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
34mm & 62mm IGBT 模块；CN；EN253 KB25 十一月 2013
Editorials
TitleSizeDateVersion
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Wind Energy Systems；EN5.4 MB18 四月 2013
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - 34 mm；EN37 KB06 一月 201403_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
EN/DE BSM50GB60DLC
EN IFS75B12N3E4_B32
EN 1EDI60I12AH
EN 2EDN7524G
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN 6ED100E12-F2
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN MA070E17
EN MA070E17
EN BYM600A170DN2
EN DD250S65K3
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN BSM50GB170DN2
EN IFS75B12N3E4_B32
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