EasyPACK 2B 650V 3-level phase leg IGBT module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode, NTC and PressFIT Contact Technology
Title | Size | Date | Version |
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F3L100R07W2E3_B11 (chinese/english),EN/CN,EN/DE,EN/JA | 1 MB | 02 十二月 2013 | 02_01 |
Title | Size | Date | Version |
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Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 四月 2016 | 03_00 |
Best-in-class products to meet your application demands;EN | 1.3 MB | 27 四月 2016 | 08_00 |
1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 五月 2016 | 01_00 |
Title | Size | Date | Version |
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利用单极栅电压驱动IGBT;CN;EN | 384 KB | 03 十一月 2015 | 01_00 |
Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 十二月 2015 | 01_02 |
电力电子模块内部NTC的使用;CN;EN | 586 KB | 26 十一月 2013 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 四月 2009 | |
Assembly Instructions - Easy-PressFIT Modules;EN | 1.5 MB | 29 四月 2013 | 02_02 |
Evaluation Board for Easy2B 3-Level Modules;EN | 1.6 MB | 14 十二月 2010 | |
E3和T3系列1200V IGBT3 模块的性能差异;CN;EN | 330 KB | 25 十一月 2013 | |
等效热路模型;CN;EN;DE | 500 KB | 25 十一月 2013 | |
如何正确计算并最大限度减小 IGBT 的死区时间;CN;EN | 1.5 MB | 26 八月 2013 | |
Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 二月 2014 | |
Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 二月 2014 | |
Series connection of IGBTs;EN | 28 KB | 10 二月 2014 | |
Paralleling of IGBTs;EN | 28 KB | 10 二月 2014 |
Title | Size | Date | Version |
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Easy & Econo 模块;CN;EN | 588 KB | 25 十一月 2013 | |
EasyB-系列模块 与Easy750;CN;EN | 524 KB | 25 十一月 2013 | |
PressFIT - Our established, reliable mounting technology;EN | 616 KB | 27 四月 2016 | 08_00 |
Modules for Photo Voltaic String and Multi-String Inverters;EN | 476 KB | 27 四月 2016 | 04_00 |
3-Level Inverter Modules;EN | 307 KB | 27 四月 2016 | 08_00 |
Title | Size | Date | Version |
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Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 十一月 2015 | 01_00 |
IGBT power modules utilizing new 650V IGBT3 and Emitter Controlled Diode3 chips for three level converter;EN | 325 KB | 31 一月 2011 | |
Reliability of PressFIT connections;EN | 472 KB | 06 六月 2008 | |
Thermal Heat Sink Interface of IGBT Modules w/o Base Plate;EN | 384 KB | 07 二月 2014 | |
PressFIT Technology, a Solderless Method for Mounting Power Modules;EN | 377 KB | 12 二月 2014 | |
Impact of module parasitics on the performance of fast-switching devices;EN | 3.7 MB | 31 五月 2014 | |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 五月 2014 |
Title | Size | Date | Version |
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Solutions for Solar Energy Systems;EN | 1.9 MB | 26 六月 2014 | 01_00 |
Solutions for Industrial Drives;EN | 2.4 MB | 27 四月 2016 | 09_00 |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 四月 2016 | 08_00 |
Title | Size | Date | Version |
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Short Form Catalog - May 2016;EN | 4.4 MB | 09 五月 2016 | 01_00 |
Title | Size | Date | Version |
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MCDS - Easy2-B;EN | 78 KB | 06 二月 2015 | 03_01 |
Board | Family | Description | Status |
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7ED020E12-FI-W2 | IGBT Modules | Evaluation Driver Board for EasyPIM™ 2B PressFIT Modules up to 1200V. Coreless transformer halfbridge IGBT drivers (2ED020I12-FI) are used for gate control and protection.Equipped with EiceDRIVER™ 2ED020I12-FIFor driving EasyPIM™ 2B PressFIT Modules | on request |
F3L030E07-F-W2 | IGBT Modules | Evaluation Driver board for 650V Easy2B 3-level modules in NPC1-topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.Equipped with EiceDRIVER™ 1ED020I12-F2For driving Easy2B 3-level Modules | on request |
Title | Size | Date | Version |
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IPOSIM;EN | 3.4 MB | 18 三月 2014 |