F3L75R07W2E3_B11

EasyPACK 2B 650V 3-level phase leg IGBT module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode, NTC and PressFIT Contact Technology.

ParametricF3L75R07W2E3_B11
Configuration3-level
IC(nom) / IF(nom)75.0A
VCE(sat) (Tvj=25°C typ)1.45V
VF (Tvj=25°C typ)1.55V
HousingEasyPACK 2B
Sales Product NameF3L75R07W2E3_B11
OPNF3L75R07W2E3B11BOMA1
Product Statusactive and preferred
Package NameAG-EASY2B-2
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size15
Packing TypeTRAY
Summary of Features:
  • Increased blocking voltage capability to 650V
  • Low inductive design
  • Low Switching Losses
  • Low V(CEsat)
  • Al(2)O(3) Substrate with Low Thermal Resistance
  • Compact Design
  • PressFIT Contact Technology
  • Rugged mounting due to integrated mounting clamps
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
功能框图
Data Sheet
TitleSizeDateVersion
F3L75R07W2E3_B11 (chinese/english),EN/CN,EN/DE,EN/JA1 MB03 十二月 201302_01
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
Assembly Instructions - Easy-PressFIT Modules；EN1.5 MB29 四月 201302_02
Evaluation Board for Easy2B 3-Level Modules；EN1.6 MB14 十二月 2010
E3和T3系列1200V IGBT3 模块的性能差异；CN；EN330 KB25 十一月 2013
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
Easy & Econo 模块；CN；EN588 KB25 十一月 2013
EasyB-系列模块 与Easy750；CN；EN524 KB25 十一月 2013
PressFIT - Our established, reliable mounting technology；EN616 KB27 四月 201608_00
Modules for Photo Voltaic String and Multi-String Inverters；EN476 KB27 四月 201604_00
3-Level Inverter Modules；EN307 KB27 四月 201608_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
IGBT power modules utilizing new 650V IGBT3 and Emitter Controlled Diode3 chips for three level converter；EN325 KB31 一月 2011
Reliability of PressFIT connections；EN472 KB06 六月 2008
Thermal Heat Sink Interface of IGBT Modules w/o Base Plate；EN384 KB07 二月 2014
PressFIT Technology, a Solderless Method for Mounting Power Modules；EN377 KB12 二月 2014
Impact of module parasitics on the performance of fast-switching devices；EN3.7 MB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Solar Energy Systems；EN1.9 MB26 六月 201401_00
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy2-B；EN78 KB06 二月 201503_01
Evaluation Boards
BoardFamilyDescriptionStatus
F3L030E07-F-W2IGBT ModulesEvaluation Driver board for 650V Easy2B 3-level modules in NPC1-topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.Equipped with EiceDRIVER™ 1ED020I12-F2For driving Easy2B 3-level Moduleson request
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
EN/CN F3L75R07W2E3_B11
EN/DE F3L75R07W2E3_B11
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