1700V PrimePACK™3 dual IGBT module with IGBT4 and NTC.
Title | Size | Date | Version |
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FF1000R17IE4D_B2 (chinese/english),EN/CN,EN/DE,EN/JA | 927 KB | 10 十二月 2013 | 02_01 |
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Best-in-class products to meet your application demands;EN | 1.3 MB | 27 四月 2016 | 08_00 |
Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 四月 2016 | 03_00 |
Title | Size | Date | Version |
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Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 十二月 2015 | 01_02 |
PrimePACK™ IGBT 模块 的适配器板;CN;EN | 1.6 MB | 25 十一月 2013 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 四月 2009 | |
电力电子模块内部NTC的使用;CN;EN | 586 KB | 26 十一月 2013 | |
PrimePACK™ 模块的安装说明;CN;EN | 645 KB | 25 十一月 2013 | |
等效热路模型;CN;EN;DE | 500 KB | 25 十一月 2013 | |
如何正确计算并最大限度减小 IGBT 的死区时间;CN;EN | 1.5 MB | 26 八月 2013 | |
Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 二月 2014 | |
Driving IGBTs with unipolar gate voltage;EN | 389 KB | 10 二月 2014 | |
Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 二月 2014 | |
Series connection of IGBTs;EN | 28 KB | 10 二月 2014 | |
Paralleling of IGBTs;EN | 28 KB | 10 二月 2014 |
Title | Size | Date | Version |
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IHM, IHV Modules & PrimePACK™;EN | 452 KB | 27 四月 2016 | 08_00 |
Title | Size | Date | Version |
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Properties of a New PrimePACK™ IGBT Module Concept;EN | 213 KB | 07 二月 2014 | |
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 十一月 2015 | 01_00 |
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 五月 2014 | |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 五月 2014 |
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Solutions for Wind Energy Systems;EN | 5.4 MB | 18 四月 2013 | |
Solutions for Industrial Drives;EN | 2.4 MB | 27 四月 2016 | 09_00 |
Solutions for construction, commercial and agricultural vehicles (CAV);EN | 6.7 MB | 30 七月 2014 | |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 四月 2016 | 08_00 |
Solutions for Traction Systems;EN | 1.5 MB | 27 四月 2016 | 08_00 |
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Short Form Catalog - May 2016;EN | 4.4 MB | 09 五月 2016 | 01_00 |
Title | Size | Date | Version |
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MCDS - PP3 89x250;EN | 37 KB | 25 三月 2014 | 05_00 |
Board | Family | Description | Status |
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2ED300E17-SFO | Gate Driver, IGBT Modules | This evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -ST | on request |
2ED300C17-S | IGBT Modules up to 1700V | EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700V | active and preferred |
2ED300C17-ST | IGBT Modules up to 1700V | EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700V | active and preferred |
MA300E17 | IGBT Modules | Evaluation Adapter board containing a booster stage for driving 1700V PrimePACK™ in single or parallel configuration. For connecting 1700V PrimePACK™ IGBT Modules and driver boards | on request |
Title | Size | Date | Version |
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IPOSIM;EN | 3.4 MB | 18 三月 2014 |