Our well-known 62 mm 1200V dual IGBT modules with the fast IGBT2 and Thermal Interface Material (TIM) pre applied for high-frequency switching are the right choice for your design.
PrimeSTACK™s available for fast development with minimum effort
Title | Size | Date | Version |
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FF300R12KS4P (chinese/english),CN/EN,EN/DE,JA/EN | 788 KB | 14 三月 2016 | 02_00 |
Title | Size | Date | Version |
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Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 四月 2016 | 03_00 |
1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 五月 2016 | 01_00 |
Best-in-class products to meet your application demands;EN | 1.3 MB | 27 四月 2016 | 08_00 |
Title | Size | Date | Version |
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利用单极栅电压驱动IGBT;CN;EN | 384 KB | 03 十一月 2015 | 01_00 |
Modules with pre-applied Thermal interface Material;EN | 393 KB | 26 一月 2016 | 01_01 |
Evaluation Adapter Board for 62mm Half Bridge IGBT Modules;EN | 969 KB | 08 十一月 2013 | |
如何正确计算并最大限度减小 IGBT 的死区时间;CN;EN | 1.5 MB | 26 八月 2013 | |
62mm Modules Application and Assembly Notes;EN;DE | 1.5 MB | 14 三月 2013 | |
评估板_AN2007_05_2ED300E17_SFO;CN;EN | 1,023 KB | 04 十一月 2015 | 01_01 |
Simple and reliable connecting system of 62 mm C- Series IGBT Modules to a Power Circuit Board (PCB);EN | 111 KB | 10 二月 2014 | |
Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 二月 2014 | |
Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 十二月 2015 | 01_02 |
等效热路模型;CN;EN;DE | 500 KB | 25 十一月 2013 | |
Series connection of IGBTs;EN | 28 KB | 10 二月 2014 | |
Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 二月 2014 | |
Paralleling of IGBTs;EN | 28 KB | 10 二月 2014 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 四月 2009 |
Title | Size | Date | Version |
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34 mm & 62 mm IGBT Modules;EN | 197 KB | 27 四月 2016 | 07_00 |
Thermal Interface Material (TIM) - The only Infineon-qualified solution;EN | 410 KB | 27 四月 2016 | 04_00 |
Title | Size | Date | Version |
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Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 十一月 2015 | 01_00 |
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 五月 2014 | |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 五月 2014 |
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Solutions for construction, commercial and agricultural vehicles (CAV);EN | 6.7 MB | 30 七月 2014 | |
Solutions for Traction Systems;EN | 1.5 MB | 27 四月 2016 | 08_00 |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 四月 2016 | 08_00 |
Solutions for Industrial Drives;EN | 2.4 MB | 27 四月 2016 | 09_00 |
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Short Form Catalog - May 2016;EN | 4.4 MB | 09 五月 2016 | 01_00 |
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MCDS - 62mm TIM;EN | 28 KB | 15 三月 2016 | 01_00 |
Title | Size | Date | Version |
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IPOSIM;EN | 3.4 MB | 18 三月 2014 |