FF300R12ME4_B11

EconoDUAL™ 3 1200V dual IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled HE Diode, NTC and PressFIT Contact Technology

ParametricFF300R12ME4_B11
ConfigurationDual
IC(nom) / IF(nom)300.0A
VCE(sat) (Tvj=25°C typ)1.75V
VF (Tvj=25°C typ)1.65V
HousingEconoDUAL™ 3
Sales Product NameFF300R12ME4_B11
OPNFF300R12ME4B11BPSA1
Product Statusactive and preferred
Package NameAG-ECONOD-3
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size6
Packing TypeTRAY
Summary of Features:
  • Low V(CEsat)
  • T(vj op) = 150°C
  • Standard Housing
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
功能框图
Data Sheet
TitleSizeDateVersion
FF300R12ME4_B11 (chinese/english),EN/CN,EN/DE,EN/JA931 KB09 十二月 201302_00
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Application Notes
TitleSizeDateVersion
评估板_AN2007_05_2ED300E17_SFO；CN；EN1,023 KB04 十一月 201501_01
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
模块的评估驱动板；CN；EN2.3 MB25 十一月 2013
安装说明 EconoDUAL™3 模块；CN；EN；DE924 KB20 八月 2012
Module Adapter Board for EconoDUAL™3 IGBT Modules；EN1.1 MB14 二月 2010
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
PressFIT - Our established, reliable mounting technology；EN616 KB27 四月 201608_00
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules；EN440 KB27 四月 201607_00
Article
TitleSizeDateVersion
Gehirn trifft Muskel: FPGA steuert Leistungshalbleiter an - Article in Elektronikpraxis 05.2014；DE512 KB14 五月 2014
FPGA to Control Power Electronics；EN246 KB01 十月 2014
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
„Econo“ my improvement in inverter-converter-moduldesign；EN90 KB07 二月 2014
IGBT Module technology state of the art and future evolutions；EN37 KB07 二月 2014
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?；EN731 KB31 一月 2011
Reliability of PressFIT connections；EN472 KB06 六月 2008
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules；EN141 KB07 二月 2014
PressFIT Technology, a Solderless Method for Mounting Power Modules；EN377 KB12 二月 2014
Improving Efficiency in AC drives: Comparison of Topologies and Device Technologies；EN892 KB31 五月 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Saving money: SiC in UPS applications；EN759 KB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Traction Systems；EN1.5 MB27 四月 201608_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - EconoDUAL 3；EN529 KB06 一月 201404_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED100E12-F2IGBT ModulesEvaluation Driver Board for EconoDUAL™3 Modules using a coreless transformer single-channel driver (replaced by the EiceDRIVER™ 1ED020I12-F2)Equipped with EiceDRIVER™ 1ED020I12-FFor driving EconoDUAL™3on request
MA200E12IGBT ModulesEvaluation Adapter board with booster stage for 1200V EconoDUAL™ 3 modules.For connecting 1200V EconoDUAL™ 3 Modules and driver boardson request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
Package Data
TitleSizeDateVersion
FF300R12ME4_B11 | EconoDUAL™3 module | AG-ECONOD-3-2；EN491 KB11 四月 201601_00
EN/CN FF300R12ME4_B11
EN/DE FF300R12ME4_B11
EN/JA FF300R12ME4_B11
EN 2EDN7524G
EN IFS75B12N3E4_B32
EN 1EDI60I12AH
CN 2ED300C17-ST
EN 2ED300C17-ST
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN 6ED100E12-F2
EN 1ED020I12-F2
CN FF150R17ME3G
EN FF150R17ME3G
DE FF150R17ME3G
EN 2ED300E17-SFO
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK180N16RR_B11
EN MA3L120E12_EVAL
DE 1EDS20I12SV
EN FF150R12MS4G
EN DD250S65K3
EN FF150R17ME3G
EN FS150R17KE3G
EN FP75R17N3E4
EN FS100R17N3E4_B11
EN FP75R17N3E4
EN FS100R17N3E4_B11
EN FF225R12ME4_B11
EN BYM600A170DN2
EN DD250S65K3
EN sic-modules
EN IFS75B12N3E4_B32
EN 2ED300C17-ST
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN FF150R17ME3G
EN IFS75B12N3E4_B32
EN FF300R12ME4_B11
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