EconoDUAL™ 3 650V dual IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled Diode, NTC and PressFIT Contact Technology
Title | Size | Date | Version |
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FF600R07ME4_B11 (chinese/english),EN/CN,EN/DE,EN/JA | 965 KB | 16 十二月 2014 | 03_01 |
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Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 四月 2016 | 03_00 |
1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 五月 2016 | 01_00 |
Best-in-class products to meet your application demands;EN | 1.3 MB | 27 四月 2016 | 08_00 |
Title | Size | Date | Version |
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Evaluation Driver Board for EconoDUAL ME3, ME4 and EconoPACK+ modules;EN | 1.9 MB | 05 五月 2011 | |
评估板_AN2007_05_2ED300E17_SFO;CN;EN | 1,023 KB | 04 十一月 2015 | 01_01 |
利用单极栅电压驱动IGBT;CN;EN | 384 KB | 03 十一月 2015 | 01_00 |
Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 十二月 2015 | 01_02 |
安装说明 EconoDUAL™3 模块;CN;EN;DE | 924 KB | 20 八月 2012 | |
Module Adapter Board for EconoDUAL™3 IGBT Modules;EN | 1.1 MB | 14 二月 2010 | |
电力电子模块内部NTC的使用;CN;EN | 586 KB | 26 十一月 2013 | |
Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 四月 2009 | |
等效热路模型;CN;EN;DE | 500 KB | 25 十一月 2013 | |
如何正确计算并最大限度减小 IGBT 的死区时间;CN;EN | 1.5 MB | 26 八月 2013 | |
Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 二月 2014 | |
Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 二月 2014 | |
Series connection of IGBTs;EN | 28 KB | 10 二月 2014 | |
Paralleling of IGBTs;EN | 28 KB | 10 二月 2014 |
Title | Size | Date | Version |
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PressFIT - Our established, reliable mounting technology;EN | 616 KB | 27 四月 2016 | 08_00 |
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules;EN | 440 KB | 27 四月 2016 | 07_00 |
Title | Size | Date | Version |
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Gehirn trifft Muskel: FPGA steuert Leistungshalbleiter an - Article in Elektronikpraxis 05.2014;DE | 512 KB | 14 五月 2014 | |
FPGA to Control Power Electronics;EN | 246 KB | 01 十月 2014 |
Title | Size | Date | Version |
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Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 十一月 2015 | 01_00 |
„Econo“ my improvement in inverter-converter-moduldesign;EN | 90 KB | 07 二月 2014 | |
IGBT Module technology state of the art and future evolutions;EN | 37 KB | 07 二月 2014 | |
650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand time;EN | 191 KB | 31 一月 2011 | |
Reliability of PressFIT connections;EN | 472 KB | 06 六月 2008 | |
PressFIT Technology, a Solderless Method for Mounting Power Modules;EN | 377 KB | 12 二月 2014 | |
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 五月 2014 | |
The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 五月 2014 |
Title | Size | Date | Version |
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Solutions for Industrial Drives;EN | 2.4 MB | 27 四月 2016 | 09_00 |
Solutions for Traction Systems;EN | 1.5 MB | 27 四月 2016 | 08_00 |
Solutions for construction, commercial and agricultural vehicles (CAV);EN | 6.7 MB | 30 七月 2014 | |
Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 四月 2016 | 08_00 |
Title | Size | Date | Version |
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Short Form Catalog - May 2016;EN | 4.4 MB | 09 五月 2016 | 01_00 |
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MCDS - EconoDUAL 3;EN | 529 KB | 06 一月 2014 | 04_00 |
Title | Size | Date | Version |
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IPOSIM;EN | 3.4 MB | 18 三月 2014 |
Title | Size | Date | Version |
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FF600R07ME4_B11 | EconoDUAL™3 module | AG-ECONOD-3-2;EN | 491 KB | 11 四月 2016 | 01_00 |