FF650R17IE4DP_B2

1700V PrimePACK™2 dual IGBT module with IGBT4, NTC and pre-applied Thermal Interface Material.

ParametricFF650R17IE4DP_B2
ConfigurationDual
IC(nom) / IF(nom)650.0A
VCE(sat) (Tvj=25°C typ)2.0V
VF (Tvj=25°C typ)1.7V
HousingPrimePACK™ 2
Sales Product NameFF650R17IE4DP_B2
OPNFF650R17IE4DPB2BOSA1
Product Statusactive and preferred
Package NameAG-PRIME2-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size3
Packing TypeTRAY
Summary of Features:
  • Extended Operation Temperature T(tvj op)
  • High DC Stability
  • High Current Density
  • Low Switching Losses
  • V(vj op) = 150°C
  • Enlarged Diode for regenerative operation
  • Low V(cesat)
  • Package with CTI > 400
  • High Creepage and Clearance Distances
  • High Power and Thermal Cycling Capability
  • Copper Base Plate
  • UL recognized
Benefits:
  • High Power Density
  • Standardized housing
Benefits:
  • High Power Density
  • Standardized housing
功能框图
Data Sheet
TitleSizeDateVersion
FF650R17IE4DP_B2 (chinese/english),CN/EN,EN/DE,JA/EN867 KB04 四月 201602_00
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
Application Notes
TitleSizeDateVersion
等效热路模型；CN；DE500 KB25 十一月 2013
Assembly Instructions PrimePACK™ Modules；EN2.3 MB27 三月 201402_00
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
PrimePACK™ IGBT 模块 的适配器板；CN；EN1.6 MB25 十一月 2013
Paralleling of IGBTs；EN28 KB10 二月 2014
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Series connection of IGBTs；EN28 KB10 二月 2014
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
Modules with pre-applied Thermal interface Material；EN393 KB26 一月 201601_01
Product Brief
TitleSizeDateVersion
Thermal Interface Material (TIM) - The only Infineon-qualified solution；EN410 KB27 四月 201604_00
IHM, IHV Modules & PrimePACK™；EN452 KB27 四月 201608_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
Properties of a New PrimePACK™ IGBT Module Concept；EN213 KB07 二月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Traction Systems；EN1.5 MB27 四月 201608_00
Solutions for Wind Energy Systems；EN5.4 MB18 四月 2013
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 七月 2014
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - PP2 89x172 TIM；EN40 KB13 四月 201606_00
Evaluation Boards
BoardFamilyDescriptionStatus
MA300E17IGBT ModulesEvaluation Adapter board containing a booster stage for driving 1700V PrimePACK™ in single or parallel configuration. For connecting 1700V PrimePACK™ IGBT Modules and driver boardson request
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
CN/EN FF650R17IE4DP_B2
EN/DE FF650R17IE4DP_B2
JA/EN FF650R17IE4DP_B2
EN 2EDN7524G
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
EN FF1400R17IP4
EN IFS75B12N3E4_B32
CN FF1400R17IP4
EN 2ED300E17-SFO
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
EN FF1400R17IP4P
EN FF1400R17IP4P
EN MA401E17
EN DD250S65K3
EN BYM600A170DN2
EN FF1400R17IP4
EN DD250S65K3
EN IFS75B12N3E4_B32
EN 2ED300C17-ST
EN IFS75B12N3E4_B32
EN XMC4500-E144X1024+AC
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN FF650R17IE4DP_B2
EN IFS75B12N3E4_B32
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