FP50R06W2E3

EasyPIM™ 2B 600V PIM IGBT module with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode and NTC

ParametricFP50R06W2E3
ConfigurationPIM Three Phase Input Rectifier
IC(nom) / IF(nom)50.0A
VCE(sat) (Tvj=25°C typ)1.45V
VF (Tvj=25°C typ)1.55V
HousingEasyPIM™ 2B
Sales Product NameFP50R06W2E3
OPNFP50R06W2E3BOMA1
Product Statusactive and preferred
Package NameAG-EASY2B-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size15
Packing TypeTRAY
Summary of Features:
  • Low Switching Losses
  • Trench IGBT 3
  • V(CEsat) with positive Temperature Coefficient
  • Low V(CEsat)
  • Al(2)O(3) Substrate with Low Thermal Resistance
  • Compact Design
  • Solder Contact Technology
  • Rugged mounting due to integrated mounting clamps
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
功能框图
Data Sheet
TitleSizeDateVersion
FP50R06W2E3 (chinese/english),EN/CN,EN/DE,EN/JA1.3 MB03 十二月 201302_02
Product Brochure
TitleSizeDateVersion
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Mounting Instructions for EasyPIM™ and EasyPACK Modules；EN；DE845 KB29 四月 2013
Soldering of Econo and Easy Modules；EN194 KB10 二月 2014
Evaluation Board for EasyPIM™2B Modules；EN611 KB14 二月 2011
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
E3和T3系列1200V IGBT3 模块的性能差异；CN；EN330 KB25 十一月 2013
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
Easy & Econo 模块；CN；EN588 KB25 十一月 2013
Editorials
TitleSizeDateVersion
Thermal Heat Sink Interface of IGBT Modules w/o Base Plate；EN384 KB07 二月 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Impact of module parasitics on the performance of fast-switching devices；EN3.7 MB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Easy2-B；EN78 KB06 二月 201503_01
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
Package Data
TitleSizeDateVersion
FP50R06W2E3 | EasyPIM™ module | AG-EASY2B-1-1；EN629 KB11 四月 201601_00
EN/CN FP50R06W2E3
EN/DE FP50R06W2E3
EN/JA FP50R06W2E3
EN IFS75B12N3E4_B32
EN 1EDI60I12AH
EN 2EDN7524G
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN FS10R12VT3
DE FS25R12W1T4
EN TDB6HK360N16P
EN 2ED020I06-FI
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN FZ250R65KE3
EN FZ250R65KE3
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN FS10R12VT3
EN DD250S65K3
EN FS3L25R12W2H3_B11
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN FS75R07W2E3_B11A
EN IFS75B12N3E4_B32
EN FP50R06W2E3
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