FP75R17N3E4

EconoPIM™ 3 1700V three phase PIM IGBT module with fast Trench/Fieldstop IGBT4, Emitter Controlled diode and NTC

ParametricFP75R17N3E4
ConfigurationPIM Three Phase Input Rectifier
IC(nom) / IF(nom)75.0A
VCE(sat) (Tvj=25°C typ)1.95V
VF (Tvj=25°C typ)1.8V
HousingEconoPIM™ 3
Sales Product NameFP75R17N3E4
OPNFP75R17N3E4BPSA1
Product Statusactive and preferred
Package NameAG-ECONO3-3
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Low stray inductance module design
  • High reliability and power density
  • Copper base plate for optimized heat spread
  • Solderable pins
  • Low switching losses
  • High switching frequency
  • RoHS-compliant modules
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized customer’s development cycle time and cost
  • Configuration flexibility
功能框图
Data Sheet
TitleSizeDateVersion
FP75R17N3E4 (chinese/english),CN/EN,EN/DE,JA/EN1 MB08 六月 201603_00
Product Brochure
TitleSizeDateVersion
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
Application Notes
TitleSizeDateVersion
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Series connection of IGBTs；EN28 KB10 二月 2014
等效热路模型；CN；EN；DE500 KB25 十一月 2013
Paralleling of IGBTs；EN28 KB10 二月 2014
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Soldering of Econo and Easy Modules；EN194 KB10 二月 2014
Product Brief
TitleSizeDateVersion
Easy & Econo 模块；CN；EN588 KB25 十一月 2013
Editorials
TitleSizeDateVersion
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules；EN141 KB07 二月 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?；EN731 KB31 一月 2011
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Econo3B - PIM；EN74 KB06 一月 201404_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
CN/EN FP75R17N3E4
EN/DE FP75R17N3E4
JA/EN FP75R17N3E4
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CN IFS75B12N3E4_B32
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DE IFS75B12N3E4_B32
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JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
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EN TDB6HK360N16P
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EN F3L030E07-F-W2
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