EconoPACK™ 3 1200V sixpack IGBT module for active front-end applications with Trench/Fieldstop IGBT4 and doubled mounting Emitter Controlled 4 Diode
| Title | Size | Date | Version |
|---|---|---|---|
| FS150R12KT4_B9 (chinese/english),EN/CN,EN/DE,EN/JA | 707 KB | 09 十二月 2013 | 02_02 |
| Title | Size | Date | Version |
|---|---|---|---|
| Product Brochure Industrial Gate Driver ICs Overview;EN | 613 KB | 27 四月 2016 | 03_00 |
| Best-in-class products to meet your application demands;EN | 1.3 MB | 27 四月 2016 | 08_00 |
| 1EDI EiceDRIVER™ Compact 300 mil;EN | 216 KB | 09 五月 2016 | 01_00 |
| Title | Size | Date | Version |
|---|---|---|---|
| Application of screen print templates to paste thermal grease within IGBT modules;EN | 489 KB | 10 二月 2014 | |
| 利用单极栅电压驱动IGBT;CN;EN | 384 KB | 03 十一月 2015 | 01_00 |
| Industrial IGBT Modules Explanation of Technical Information;EN;JA | 2.2 MB | 03 十二月 2015 | 01_02 |
| 电力电子模块内部NTC的使用;CN;EN | 586 KB | 26 十一月 2013 | |
| Application Note IGBT Definition of Junction Temperature;EN | 84 KB | 09 四月 2009 | |
| Soldering of Econo and Easy Modules;EN | 194 KB | 10 二月 2014 | |
| 等效热路模型;CN;EN;DE | 500 KB | 25 十一月 2013 | |
| 如何正确计算并最大限度减小 IGBT 的死区时间;CN;EN | 1.5 MB | 26 八月 2013 | |
| Aging stability of various heatconducting pastes for use with modules without baseplates;EN | 111 KB | 10 二月 2014 | |
| Series connection of IGBTs;EN | 28 KB | 10 二月 2014 | |
| Paralleling of IGBTs;EN | 28 KB | 10 二月 2014 |
| Title | Size | Date | Version |
|---|---|---|---|
| Easy & Econo 模块;CN;EN | 588 KB | 25 十一月 2013 |
| Title | Size | Date | Version |
|---|---|---|---|
| Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules;EN | 297 KB | 04 十一月 2015 | 01_00 |
| On the loss - softness trade-off: Are different chip versions needed for softness-improvement?;EN | 731 KB | 31 一月 2011 | |
| 1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules;EN | 141 KB | 07 二月 2014 | |
| Improving Efficiency in AC drives: Comparison of Topologies and Device Technologies;EN | 892 KB | 31 五月 2014 | |
| Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates;EN | 704 KB | 31 五月 2014 | |
| The challenge of accurately analyzing thermal resistances;EN | 1.1 MB | 31 五月 2014 | |
| Saving money: SiC in UPS applications;EN | 759 KB | 31 五月 2014 |
| Title | Size | Date | Version |
|---|---|---|---|
| Solutions for Industrial Drives;EN | 2.4 MB | 27 四月 2016 | 09_00 |
| Solutions for Uninterruptible Power Supply (UPS) Systems;EN | 2.6 MB | 27 四月 2016 | 08_00 |
| Title | Size | Date | Version |
|---|---|---|---|
| Short Form Catalog - May 2016;EN | 4.4 MB | 09 五月 2016 | 01_00 |
| Title | Size | Date | Version |
|---|---|---|---|
| MCDS - Econo3B;EN | 37 KB | 06 一月 2014 | 03_00 |
| Board | Family | Description | Status |
|---|---|---|---|
| 2ED300E17-SFO | Gate Driver, IGBT Modules | This evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -ST | on request |
| 2ED300C17-S | IGBT Modules up to 1700V | EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700V | active and preferred |
| 2ED300C17-ST | IGBT Modules up to 1700V | EiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700V | active and preferred |
| Title | Size | Date | Version |
|---|---|---|---|
| IPOSIM;EN | 3.4 MB | 18 三月 2014 |
| Title | Size | Date | Version |
|---|---|---|---|
| FS150R12KT4_B9 | AG-ECONO3-4-1;EN | 415 KB | 11 四月 2016 | 01_00 |