FS450R12KE4

EconoPACK™ + B-series 1200V sixpack IGBT module with Trench/Fieldstop IGBT4 and optimized Emitter Controlled diode

ParametricFS450R12KE4
ConfigurationSixpack
IC(nom) / IF(nom)450.0A
VCE(sat) (Tvj=25°C typ)1.75V
VF (Tvj=25°C typ)1.65V
HousingEconoPACK™ + B
Sales Product NameFS450R12KE4
OPNFS450R12KE4BOSA1
Product Statusnot for new design
Package NameAG-ECONOPP-1
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size4
Packing TypeTRAY
Summary of Features:
  • Easy separation of DC and AC
  • Optimized Thermal Resistance Case to Heat Sink
  • Highest Power Density for compact Inverter Designs
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
功能框图
Data Sheet
TitleSizeDateVersion
FS450R12KE4 (chinese/english),EN/CN,EN/DE,EN/JA873 KB09 十二月 201302_02
Product Brochure
TitleSizeDateVersion
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
Application Notes
TitleSizeDateVersion
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
Soldering of Econo and Easy Modules；EN194 KB10 二月 2014
模块的评估驱动板；CN；EN2.3 MB25 十一月 2013
EconoPACK™+ 的并联；CN；EN759 KB26 八月 2013
EconoPACK+ 模块的装配；CN；EN274 KB25 十一月 2013
Evaluation Board for 2ED300C17 -S/ -ST (AN2007-05)；EN630 KB05 二月 2008
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules；EN440 KB27 四月 201607_00
PressFIT - Our established, reliable mounting technology；EN616 KB27 四月 201608_00
Editorials
TitleSizeDateVersion
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
IGBT Module technology state of the art and future evolutions；EN37 KB07 二月 2014
Benefits of System-oriented IGBT Module Design for High Power Inverters；EN844 KB07 十一月 2007
Research of Current Distribution in IGBT Modules with Multiple Chips in Parallel；EN324 KB07 二月 2014
EconoPACK™ + A package with enhanced characteristics；EN572 KB31 五月 2011
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?；EN731 KB31 一月 2011
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules；EN141 KB07 二月 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 七月 2014
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Solutions for Traction Systems；EN1.5 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - EconoPACK+ B-series；EN220 KB06 一月 201404_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
6ED100E12-F2IGBT ModulesEvaluation Driver board for EconoPACK™+ IGBT modules, using a coreless transformer single-channel driver (replaced by 1ED020I12-F2).Equipped with EiceDRIVER™ 1ED020I12-FFor driving EconoPACK™+ IGBT Moduleson request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
Package Data
TitleSizeDateVersion
FS450R12KE4 | AG-ECONOPP-1-1；EN555 KB11 四月 201601_00
EN/CN FS450R12KE4
EN/DE FS450R12KE4
EN/JA FS450R12KE4
EN 1EDI60I12AH
EN 2EDN7524G
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
EN TDB6HK360N16P
CN 6ED100E12-F2
EN 1ED020I12-F2
CN FS150R12KE3G
EN FS150R17KE3G
CN FS150R17KE3G
EN FS150R17KE3G
EN 2ED300C17-ST
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK360N16P
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN MA3L120E12_EVAL
EN TDB6HK180N16RR_B11
EN DD250S65K3
EN FS150R17KE3G
EN FS150R17KE3G
EN FS150R17KE3G
EN FS150R17KE3G
EN FP75R17N3E4
EN FP75R17N3E4
EN BYM600A170DN2
EN DD250S65K3
EN IFS75B12N3E4_B32
EN XMC4500-E144X1024+AC
EN IFS75B12N3E4_B32
EN 2ED300C17-ST
EN IDV20E65D1
EN FS150R17KE3G
EN IFS75B12N3E4_B32
EN FS450R12KE4
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