FS500R17OE4D

EconoPACK™ + D-series 1700V sixpack IGBT module with Trench/Fieldstop IGBT4, enhanced Emitter Controlled diode, NTC and PressFIT Contact Technology

ParametricFS500R17OE4D
ConfigurationSixpack
IC(nom) / IF(nom)500.0A
VCE(sat) (Tvj=25°C typ)1.95V
VF (Tvj=25°C typ)1.7V
HousingEconoPACK™ + D
Sales Product NameFS500R17OE4D
OPNFS500R17OE4DBOSA1
Product Statusactive and preferred
Package NameAG-ECONOPP-2
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size4
Packing TypeTRAY
Summary of Features:
  • High Short Circuit Capability
  • Self Limiting Short Circuit Current
  • Enhanced Diode
  • Unbeatable Robustness
  • T(vj op) = 150°C
  • High surge current capability
  • High mechanical robustness
  • Integrated NTC temperature sensor
  • Isolated Base Plate
  • RoHS compliant
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
Benefits:
  • Compact Modules
  • Easy and most reliable assembly
  • No Plugs and Cables required
  • Ideal for Low Inductive System Designs
功能框图
Data Sheet
TitleSizeDateVersion
FS500R17OE4D (chinese/english),EN/CN,EN/DE,EN/JA951 KB14 五月 201403_00
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
Application Notes
TitleSizeDateVersion
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
等效热路模型；CN；EN；DE500 KB25 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Editorials
TitleSizeDateVersion
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
Package Data
TitleSizeDateVersion
FS500R17OE4D | EconoPACK™+ module | AG-ECONOPP-2-1；EN532 KB11 四月 201601_00
EN/CN FS500R17OE4D
EN/DE FS500R17OE4D
EN/JA FS500R17OE4D
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