FS75R07N2E4_B11

EconoPACK™ 2 650V sixpack IGBT module with Trench/Fieldstop IGBT4, Emitter Controlled 4 diode, NTC and PressFIT Contact Technology

ParametricFS75R07N2E4_B11
ConfigurationSixpack
IC(nom) / IF(nom)75.0A
VCE(sat) (Tvj=25°C typ)1.55V
VF (Tvj=25°C typ)1.55V
HousingEconoPACK™ 2
Sales Product NameFS75R07N2E4_B11
OPNFS75R07N2E4B11BOSA1
Product Statusactive and preferred
Package NameAG-ECONO2-6
Completely lead freeno
Halogen freeno
RoHS compliantyes
Packing Size10
Packing TypeTRAY
Summary of Features:
  • Increased blocking voltage capability to 650V
  • High Short Circuit Capability
  • Self Limiting Short Circuit Current
  • Trench IGBT 4
  • T(vj op) = 150°C
  • Integrated NTC temperature sensor
  • Copper Base Plate
  • Standard Housing
Benefits:
  • Compact module concept
  • Optimized development cycle time and cost
  • Configuration flexibility
Benefits:
  • Compact module concept
  • Optimized development cycle time and cost
  • Configuration flexibility
功能框图
Data Sheet
TitleSizeDateVersion
FS75R07N2E4_B11 (chinese/english),EN/CN,EN/DE,EN/JA946 KB02 十二月 201302_00
Product Brochure
TitleSizeDateVersion
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Application Notes
TitleSizeDateVersion
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
Mounting instruction for PressFIT with forked pins；EN；DE675 KB04 十二月 2012
等效热路模型；CN；EN；DE500 KB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Product Brief
TitleSizeDateVersion
Easy & Econo 模块；CN；EN588 KB25 十一月 2013
PressFIT - Our established, reliable mounting technology；EN616 KB27 四月 201608_00
Editorials
TitleSizeDateVersion
650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand time；EN191 KB31 一月 2011
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Reliability of PressFIT connections；EN472 KB06 六月 2008
PressFIT Technology, a Solderless Method for Mounting Power Modules；EN377 KB12 二月 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Application Brochure
TitleSizeDateVersion
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Product Catalogue
TitleSizeDateVersion
Short Form Catalog - May 2016；EN4.4 MB09 五月 201601_00
Material Content Data Sheet
TitleSizeDateVersion
MCDS - Econo2B；EN36 KB06 一月 201403_00
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
EN/CN FS75R07N2E4_B11
EN/DE FS75R07N2E4_B11
EN/JA FS75R07N2E4_B11
EN 2EDN7524G
EN IFS75B12N3E4_B32
EN 1EDI60I12AH
EN TDB6HK360N16P
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN TDB6HK180N16RR_B11
DE TDB6HK180N16RR_B11
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN F3L030E07-F-W2
EN F3L030E07-F-W2
EN TDB6HK180N16RR_B11
EN FS50R07U1E4
EN DD250S65K3
EN FS100R17N3E4_B11
EN FS100R17N3E4_B11
EN BYM600A170DN2
EN DD250S65K3
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN IDV20E65D1
EN DDB6U104N16RR
EN IFS75B12N3E4_B32
Products 产品服务
Manufacturers 生产厂家
联系购买Sales
©1993 - 2024 BDTIC