IPL60R2K1C6S
The new CoolMOS™ ThinPAK 5x6 is a leadless SMD package especially designed for High Voltage MOSFETs. This new package has a very small footprint of 5x6mm 2 and a very low profile with only 1mm height.
This significantly smaller package size in combination with its benchmark low parasitics inductances can be used as a new and effective way to decrease system solution size in power- density driven designs. The ThinPAK 5x6 package is characterized by a very low source inductance 1.6nH, as well as a similar thermal performance as DPAK.
The package hence enables faster and thus more efficient switching of Power MOSFETs and is easier to handle in terms of switching behavior and EMI.
Parametric | IPL60R2K1C6S |
---|
Budgetary Price €/1k | 0.28 |
---|
Package | ThinPAK 5x6 |
---|
VDS
max | 600.0V |
---|
RDS (on)
max | 2100.0mΩ |
---|
Polarity | N |
---|
ID
max | 2.3A |
---|
Ptot
max | 21.6W |
---|
IDpuls
max | 5.4A |
---|
VGS(th)
min
max | 2.5V
3.5V |
---|
QG | 6.7nC |
---|
Rth | 5.8K/W |
---|
RthJC
max | 5.8K/W |
---|
RthJA
max | 62.0K/W |
---|
Operating Temperature
min | -40.0°C |
---|
Pin Count | 5.0Pins |
---|
Mounting | SMT |
---|
Sales Product Name | IPL60R2K1C6S |
---|
OPN | IPL60R2K1C6SATMA1 |
---|
Product Status | active and preferred |
---|
Package Name | PG-TSON-8 |
---|
Completely lead free | no |
---|
Halogen free | yes |
---|
RoHS compliant | yes |
---|
Packing Size | 5000 |
---|
Packing Type | TAPE & REEL |
---|
| |
---|
| Summary of Features:- Small footprint (5x6mm²)
- Low profile (1mm)
- Low parasitic inductance
- RoHS compliant
- Halogen free mold compound
Benefits:- Reduced board space consumption
- Increased power density
- Short commutation loop
- Easy to use products
- Environmentally friendly
Target Applications: |
Data Sheet
Product Brochure
Application Notes
Product Brief
Article
Additional Product Information
Application Brochure
Product Selection Guide
Package Data