IPL65R650C6S
The new CoolMOS™ ThinPAK 5x6 is a leadless SMD package especially designed for High Voltage MOSFETs. This new package has a very small footprint of 5x6mm 2 and a very low profile with only 1mm height.
This significantly smaller package size in combination with its benchmark low parasitics inductances can be used as a new and effective way to decrease system solution size in power- density driven designs. The ThinPAK 5x6 package is characterized by a very low source inductance 1.6nH, as well as a similar thermal performance as DPAK.
The package hence enables faster and thus more efficient switching of Power MOSFETs and is easier to handle in terms of switching behavior and EMI.
| Parametric | IPL65R650C6S |
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| Budgetary Price €/1k | 0.59 |
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| Package | ThinPAK 5x6 |
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| VDS
max | 650.0V |
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| RDS (on)
max | 650.0mΩ |
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| Polarity | N |
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| ID
max | 6.7A |
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| Ptot
max | 56.8W |
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| IDpuls
max | 16.6A |
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| VGS(th)
min
max | 2.5V
3.5V |
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| QG | 21.0nC |
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| Rth | 2.2K/W |
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| RthJC
max | 2.2K/W |
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| RthJA
max | 62.0K/W |
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| Operating Temperature
min | -4.0°C |
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| Pin Count | 5.0Pins |
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| Mounting | SMT |
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| Sales Product Name | IPL65R650C6S |
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| OPN | IPL65R650C6SATMA1 |
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| Product Status | active and preferred |
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| Package Name | PG-TSON-8 |
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| Completely lead free | no |
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| Halogen free | yes |
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| RoHS compliant | yes |
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| Packing Size | 5000 |
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| Packing Type | TAPE & REEL |
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| Moisture Level | 1 |
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| Summary of Features:- Small footprint (5x6mm²)
- Low profile (1mm)
- Low parasitic inductance
- RoHS compliant
- Halogen free mold compound
Benefits:- Reduced board space consumption
- Increased power density
- Short commutation loop
- Easy to use products
- Environmentally friendly
Target Applications: |
Data Sheet
Product Brochure
Application Notes
Product Brief
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Additional Product Information
Application Brochure
Product Selection Guide
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