The Infineon REAL3™ Image Sensor family consists of highly integrated and sophisticated 3D Time-of-Flight (ToF) imager. The ToF sensors have been jointly developed by Infineon and pmdtechnologies gmbh. They embed a high performance ToF pixel-matrix from pmd and are manufactured in Infineon’s volume-proven CMOS process which enabled Infineon to integrate the photosensitive area together with mixed signal circuitry into a single chip.
As such the REAL3™ Image Sensor family brings together all ingredients to establish 3D technology in high volume consumer applications: robust and accurate depth data by meeting size and power consumption requirements of mobile devices.
|IRS1125C||352 x 288 pixel (100k pixel)||single-chip ToF sensor with micro-lenses; full resolution||bare die|
|IRS1645C||224 x 172 pixel (38k pixel)||single-chip ToF sensor with micro-lenses; size optimized ASIC||bare die|
|IRS1615C||160 x 120 pixel (19k pixel)||single-chip ToF sensor with micro-lenses; size optimized ASIC||bare die|
|Real3 (TM) image sensor family - 3D depth sensing based on Time-of-Flight；EN||206 KB||14 十二月 2015||01_00|