Infineon's ThinPAK 8x8, a leadless SMD package for High Voltage MOSFETs, has a very small footprint of only 64mm² (vs. 150mm² for the D²PAK) and a very low profile with only 1mm height (vs. 4.4mm for the D²PAK). This significantly smaller package size in combination with its benchmark low parasitic inductances is highly effective to decrease system solution size in power-density driven designs.
| Part Number | V DS (max) | I D (max) | R DS(on) [mΩ] | Q g [nC] | Halogen-Free |
|---|---|---|---|---|---|
| IPL65R230C7 | 650 | 10A | 225/230 | 20 | yes |
| IPL65R130C7 | 650 | 15A | 125/130 | 35 | yes |
| Part Number | V DS (max) | I D (max) | R DS(on) [mΩ] | Q g [nC] | Halogen-Free |
|---|---|---|---|---|---|
| IPL65R340CFD | 650 | 10.9A | 340 | 41.0 | yes |
| IPL65R460CFD | 650 | 8.3A | 460 | 31.5 | yes |
| IPL65R725CFD | 650 | 5.8A | 725 | 20.0 | yes |
| Part Number | V DS (max) | I D (max) | R DS(on) [mΩ] | Q g [nC] | Halogen-Free |
|---|---|---|---|---|---|
| IPL60R199CP | 600 | 16.4 | 199 | 32 | yes |
| IPL60R385CP | 600 | 9.0 | 385 | 17 | yes |
| IPL60R299CP | 600 | 11.1 | 299 | 22 | yes |
| Title | Size | Date | Version |
|---|---|---|---|
| NEW! Power Management Selection Guide 2016；EN | 4.7 MB | 22 二月 2016 | 00_00 |
| Title | Size | Date | Version |
|---|---|---|---|
| CoolMOS™ Benefits in Hard and Soft Switching；EN | 1.5 MB | 09 六月 2016 | 06_16 |
| CoolMOS™ Selection Guide；EN | 2.7 MB | 30 五月 2016 | 02_00 |
| Title | Size | Date | Version |
|---|---|---|---|
| Product Brief CoolMOS™ in ThinPAK 8x8 | 283 KB | 01 四月 2010 |
| Title | Size | Date | Version |
|---|---|---|---|
| Application Note Introduction to Infineon`s Simulation Models for Power MOSFETs | 701 KB | 06 三月 2014 | |
| Application Note CoolMOS™ Primary Side MOSFET Selection for LLC Topology | 880 KB | 14 八月 2014 | |
| Application Note Introduction to Infineons Power MOSFET Simulation Models；EN | 701 KB | 30 十一月 2015 | 01_00 |
| Application Note OptiMOS™ Datasheet Explanation；EN | 663 KB | 01 十二月 2012 | |
| Application Note High Voltage Cooling of thinPAK | 480 KB | 01 四月 2012 | |
| Application Note High Voltage Recommendations for PCB Assembly of VDSON Packages (thinPAK 8x8) | 4.3 MB | 12 十二月 2013 |
| Title | Size | Date | Version |
|---|---|---|---|
| Application Brochure - Infineon Solutions for Transportation；EN | 6.9 MB | 01 六月 2013 | 00_00 |
| Solutions for Solar Energy Systems；EN | 1.9 MB | 26 六月 2014 | 01_00 |
