Infineon's ThinPAK 8x8, a leadless SMD package for High Voltage MOSFETs, has a very small footprint of only 64mm² (vs. 150mm² for the D²PAK) and a very low profile with only 1mm height (vs. 4.4mm for the D²PAK). This significantly smaller package size in combination with its benchmark low parasitic inductances is highly effective to decrease system solution size in power-density driven designs.
Part Number | V DS (max) | I D (max) | R DS(on) [mΩ] | Q g [nC] | Halogen-Free |
---|---|---|---|---|---|
IPL65R230C7 | 650 | 10A | 225/230 | 20 | yes |
IPL65R130C7 | 650 | 15A | 125/130 | 35 | yes |
Part Number | V DS (max) | I D (max) | R DS(on) [mΩ] | Q g [nC] | Halogen-Free |
---|---|---|---|---|---|
IPL65R340CFD | 650 | 10.9A | 340 | 41.0 | yes |
IPL65R460CFD | 650 | 8.3A | 460 | 31.5 | yes |
IPL65R725CFD | 650 | 5.8A | 725 | 20.0 | yes |
Part Number | V DS (max) | I D (max) | R DS(on) [mΩ] | Q g [nC] | Halogen-Free |
---|---|---|---|---|---|
IPL60R199CP | 600 | 16.4 | 199 | 32 | yes |
IPL60R385CP | 600 | 9.0 | 385 | 17 | yes |
IPL60R299CP | 600 | 11.1 | 299 | 22 | yes |
Title | Size | Date | Version |
---|---|---|---|
NEW! Power Management Selection Guide 2016;EN | 4.7 MB | 22 Feb 2016 | 00_00 |
Title | Size | Date | Version |
---|---|---|---|
CoolMOS™ Selection Guide;EN | 2.7 MB | 30 May 2016 | 02_00 |
CoolMOS™ Benefits in Hard and Soft Switching;EN | 1.5 MB | 09 Jun 2016 | 06_16 |
Title | Size | Date | Version |
---|---|---|---|
Product Brief CoolMOS™ in ThinPAK 8x8 | 283 KB | 01 Apr 2010 |
Title | Size | Date | Version |
---|---|---|---|
Application Note OptiMOS™ Datasheet Explanation;EN | 663 KB | 01 Dec 2012 | |
Application Note Introduction to Infineons Power MOSFET Simulation Models;EN | 701 KB | 30 Nov 2015 | 01_00 |
Application Note Introduction to Infineon`s Simulation Models for Power MOSFETs | 701 KB | 06 Mar 2014 | |
Application Note CoolMOS™ Primary Side MOSFET Selection for LLC Topology | 880 KB | 14 Aug 2014 | |
Application Note High Voltage Cooling of thinPAK | 480 KB | 01 Apr 2012 | |
Application Note High Voltage Recommendations for PCB Assembly of VDSON Packages (thinPAK 8x8) | 4.3 MB | 12 Dec 2013 |
Title | Size | Date | Version |
---|---|---|---|
Application Brochure - Infineon Solutions for Transportation;EN | 6.9 MB | 01 Jun 2013 | 00_00 |
Solutions for Solar Energy Systems;EN | 1.9 MB | 26 Jun 2014 | 01_00 |