1PS88SB82: 15 V、30 mA低Cd肖特基势垒二极管
外延低电容肖特基势垒二极管封包在极小的SMD塑料封装中。
1PS88SB82: 产品结构框图
1PS88SB82: 应用结构框图
SOT363
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 15 V, 30 mA low Cd Schottky barrier diodes (REV 4.0) PDF (109.0 kB) 1PS66SB82_1PS88SB82 [English] | 27 Jan 2010 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| TSSOP6; reel pack; reversed product orientation; 12NC ending 165 (REV 1.0) PDF (188.0 kB) SOT363_165 [English] | 20 Nov 2012 |
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English] | 15 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| 1PS88SB82 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS88SB82 [English] | 31 Jan 2015 |
| 1PS88SB82 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS88SB82_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
SPICE
- 1PS88SB82 SPICE model (REV 1.4) prm 1PS88SB82_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1PS88SB82 | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | 0.2@VR=1V | triple isolated | 340@IF=1mA | 1@VR=0V | 15 | 30 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1PS88SB82 | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 13" Q3/T4 in LargePack, Reverse | Active | 1PS88SB82,165 (9340 565 80165) | E1% | 1PS88SB82 |    | week 23, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | 1PS88SB82,115 (9340 565 80115) | E1% | 1PS88SB82 | | week 23, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- 1PS88SB82 NXP® Product Reliability 1PS88SB82
- 1PS88SB82 NXP Product Quality 1PS88SB82
- MAR_SOT363 Topmark BSS84AKS
- 1PS88SB82 SPICE model 1PS88SB82
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSSOP6; reel pack; reversed product orientation; 12NC ending 165 1PS88SB82
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- 1PS66SB82_1PS88SB82
- 1PS66SB82_1PS88SB82
- BFU520Y
