1PS88SB82: 15 V、30 mA低Cd肖特基势垒二极管

外延低电容肖特基势垒二极管封包在极小的SMD塑料封装中。

1PS88SB82: 产品结构框图
1PS88SB82: 应用结构框图
SOT363
数据手册 (1)
名称/描述Modified Date
15 V, 30 mA low Cd Schottky barrier diodes (REV 4.0) PDF (109.0 kB) 1PS66SB82_1PS88SB82 [English]27 Jan 2010
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
TSSOP6; reel pack; reversed product orientation; 12NC ending 165 (REV 1.0) PDF (188.0 kB) SOT363_165 [English]20 Nov 2012
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English]15 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
1PS88SB82 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS88SB82 [English]31 Jan 2015
1PS88SB82 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS88SB82_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (3)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English]03 Jun 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)IR [max] (µA)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)VR [max] (V)IF [max] (mA)VR (V)
1PS88SB82ActiveSOT363TSSOP62 x 1.25 x 0.950.2@VR=1Vtriple isolated340@IF=1mA1@VR=0V1530
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
1PS88SB82SOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 13" Q3/T4 in LargePack, ReverseActive1PS88SB82,165 (9340 565 80165)E1%1PS88SB82week 23, 2003157.00.731.37E911
Reel 7" Q1/T1Active1PS88SB82,115 (9340 565 80115)E1%1PS88SB82week 23, 2003157.00.731.37E911
15 V, 30 mA low Cd Schottky barrier diodes 1PS88SB82
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
1PS88SB82 NXP® Product Reliability 1PS88SB82
1PS88SB82 NXP Product Quality 1PS88SB82
MAR_SOT363 Topmark BSS84AKS
1PS88SB82 SPICE model 1PS88SB82
plastic surface-mounted package; 6 leads BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
TSSOP6; reel pack; reversed product orientation; 12NC ending 165 1PS88SB82
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
1PS66SB82_1PS88SB82
1PS66SB82_1PS88SB82
BFU520Y