1PS88SB82: 15 V, 30 mA low Cd Schottky barrier diodes
Epitaxial low capacitance Schottky barrier diodes encapsulated in very small SMD plastic packages.
1PS88SB82: Product Block Diagram
1PS88SB82: Block Diagram
SOT363
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 15 V, 30 mA low Cd Schottky barrier diodes (REV 4.0) PDF (109.0 kB) 1PS66SB82_1PS88SB82 | 27 Jan 2010 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| TSSOP6; reel pack; reversed product orientation; 12NC ending 165 (REV 1.0) PDF (188.0 kB) SOT363_165 | 20 Nov 2012 |
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 | 15 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| 1PS88SB82 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS88SB82 | 31 Jan 2015 |
| 1PS88SB82 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS88SB82_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 | 03 Jun 2013 |
SPICE model
- 1PS88SB82 SPICE model (REV 1.4) prm 1PS88SB82_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1PS88SB82 | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | 0.2@VR=1V | triple isolated | 340@IF=1mA | 1@VR=0V | 15 | 30 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1PS88SB82 | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 13" Q3/T4 in LargePack, Reverse | Active | 1PS88SB82,165 (9340 565 80165) | E1% | 1PS88SB82 |    | week 23, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | 1PS88SB82,115 (9340 565 80115) | E1% | 1PS88SB82 | | week 23, 2003 | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- 1PS88SB82 NXP® Product Reliability 1PS88SB82
- 1PS88SB82 NXP Product Quality 1PS88SB82
- MAR_SOT363 Topmark BSS84AKS
- 1PS88SB82 SPICE model 1PS88SB82
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSSOP6; reel pack; reversed product orientation; 12NC ending 165 1PS88SB82
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- 1PS66SB82_1PS88SB82
- 1PS66SB82_1PS88SB82
- BFU520Y
