74AUP2G0604GM: 低功耗反相缓冲器,带开漏和反相器

74AUP2G0604是带开漏输出和单路反相器的单路反相缓冲器。该器件具有两个输入针脚(nA)、一个输出针脚(2Y)和一个开漏输出针脚(1Y)。

所有输入处的施密特触发器动作使电路容许整个0.8 V至3.6 V VCC范围内较慢的输入上升和下降时间。

该器件可确保整个0.8 V至3.6 V VCC范围内的极低静态和动态功耗。

该器件完全适合使用IOFF的局部掉电应用。IOFF电路可禁用输出,防止掉电时破坏性回流电流通过该器件。

Outline 3d SOT886
数据手册 (1)
名称/描述Modified Date
Low-power inverting buffer with open-drain and inverter (REV 1.0) PDF (226.0 kB) 74AUP2G0604 [English]23 Nov 2012
应用说明 (2)
名称/描述Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]13 Mar 2013
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
手册 (3)
名称/描述Modified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]16 Feb 2015
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic (REV 1.0) PDF (1.4 MB) 75017458 [English]13 Oct 2014
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]20 May 2014
封装信息 (1)
名称/描述Modified Date
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
IBIS
订购信息
型号状态FamilyVCC (V)功能类型说明Logic switching levelsPackage versionOutput drive capability (mA)tpd (ns)fmax (MHz)No of bitsPower dissipation considerationsTamb (Cel)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package nameNo of pins
74AUP2G0604GMActiveAUP1.1 - 3.6CombinationCombination gatesinverter with open-drain and inverterCMOSSOT886+/- 1.94702ultra low-40~1252906.5145XSON66
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
74AUP2G0604GMSOT886Reflow_Soldering_ProfileReel 7" Q3/T4, ReverseActive74AUP2G0604GMH (9352 996 53125)a674AUP2G0604GMAlways Pb-free11
Low-power inverting buffer with open-drain and inverter 74AUP2G0604GW
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
MicroPak soldering information NTS0102_Q100
電圧レベルシフタ 74AVC16245DGG-Q100
NXP® ultra-low-power CMOS logic 74AUP1G/2G/3Gxxx: Advanced, ultra-low-power CMOS logic 74AUP1G86GW-Q100
Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100
MAR_SOT886 Topmark prtr5v0u2f
IBIS model 74AUP2G0604GW
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
BGU8007