The 74AUP2G16 provides two low-power, low-voltage buffers.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
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Low-power dual buffer (REV 2.0) PDF (161.0 kB) 74AUP2G16 [English] | 07 Oct 2016 |
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plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
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Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (188.0 kB) SOT363_125 [English] | 20 Nov 2012 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
型号 | 状态 | VCC (V) | Family | Logic switching levels | 说明 | Output drive capability (mA) | fmax (MHz) | No of bits | tpd (ns) | Power dissipation considerations | Tamb (Cel) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | No of pins | Package version |
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74AUP2G16GW | Active | 1.1 - 3.6 | AUP | CMOS | dual buffer | +/- 1.9 | 70 | 2 | 3.9 | ultra low | -40~125 | 264 | 38.6 | 153 | TSSOP6 | 6 | SOT363 |
产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | MSL | MSL LF |
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74AUP2G16GW | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | 74AUP2G16GWH (9353 075 47125) | Standard Marking | 74AUP2G16GW | Always Pb-free | 1 | 1 |