BC848W: 30 V,100 mA NPN通用晶体管

NPN通用晶体管,采用表面贴装器件(SMD)塑料封装。

BC848W: 产品结构框图
BC848W: 应用结构框图
SOT323
数据手册 (1)
名称/描述Modified Date
30 V, 100 mA NPN general-purpose transistors (REV 7.0) PDF (124.0 kB) BC848_SER [English]07 Dec 2009
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 [English]16 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT323_135 [English]16 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
BC848W NXP Product Quality (REV 1.2) PDF (74.0 kB) BC848W_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC848W NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC848W_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)Ptot (mW)ComplementIC [max] (mA)ConfigurationPolarityIC max (mA)Ptot [max] (mW)VCEO [max] (V)hFE maxfT [min] (MHz)hFE [max]fr [min] (MHz)hFE [min]
BC848WActiveSOT323SC-702 x 1.25 x 0.952501001NPN30800110
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC848WSOT323Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC848W,115 (9340 220 60115)1M%BC848Wweek 30, 2003153.00.711.41E911
Reel 11¼" Q1/T1 in LargePackActiveBC848W,135 (9340 220 60135)1M%BC848Wweek 30, 2003153.00.711.41E911
30 V, 100 mA NPN general-purpose transistors BC848W
BC848W NXP Product Quality BC848W
BC848W NXP® Product Reliability BC848W
Letter Symbols - Transistors; General PEMD16
BC848W SPICE model BC848W
plastic surface-mounted package; 3 leads BSS84AKW
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKW
Tape reel SMD; standard product orientation 12NC ending 135 BAT854CW
PMBTA45
PRF947