NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages.
Name/Description | Modified Date |
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30 V, 100 mA NPN general-purpose transistors (REV 7.0) PDF (124.0 kB) BC848_SER | 07 Dec 2009 |
Name/Description | Modified Date |
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plastic surface-mounted package; 3 leads (REV 1.0) PDF (217.0 kB) SOT323 | 08 Feb 2016 |
Name/Description | Modified Date |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT323_115 | 16 Nov 2012 |
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT323_135 | 16 Nov 2012 |
Name/Description | Modified Date |
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BC848W NXP Product Quality (REV 1.2) PDF (74.0 kB) BC848W_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
BC848W NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC848W_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | Ptot (mW) | Complement | IC [max] (mA) | Configuration | IC max (mA) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | hFE max | fT [min] (MHz) | hFE [max] | fr [min] (MHz) | hFE [min] |
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BC848W | Active | SOT323 | SC-70 | 2 x 1.25 x 0.95 | 250 | 100 | 1 | NPN | 30 | 800 | 110 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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BC848W | SOT323 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BC848W,115 (9340 220 60115) | 1M% | BC848W | week 30, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||
Reel 11¼" Q1/T1 in LargePack | Active | BC848W,135 (9340 220 60135) | 1M% | BC848W | week 30, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |