BSH111BK: 55 V, N-channel Trench MOSFET _ BDTIC 中国领先电子元器件代理商

BSH111BK: 55 V, N-channel Trench MOSFET

N-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

SOT023

数据手册 (1)

名称/描述	Modified Date
55 V, N-channel Trench MOSFET (REV 1.0) PDF (283.0 kB) BSH111BK [English]	26 Nov 2014

应用说明 (6)

名称/描述	Modified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English]	13 Jul 2016
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English]	22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English]	19 May 2014
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English]	14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English]	16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English]	27 Jan 2011

选型工具指南 (2)

名称/描述	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]	17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English]	11 Sep 2014

封装信息 (1)

名称/描述	Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English]	08 Feb 2016

包装 (1)

名称/描述	Modified Date
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English]	16 Nov 2012

可靠性与质量信息 (2)

名称/描述	Modified Date
BSH111BK NXP Product Quality (REV 1.2) PDF (74.0 kB) BSH111BK_NXP_PRODUCT_QUALITY [English]	31 Jan 2015
BSH111BK NXP® Product Reliability (REV 1.1) PDF (84.0 kB) BSH111BK_NXP_PRODUCT_RELIABILITY [English]	31 Jan 2015

支持信息 (3)

名称/描述	Modified Date
Power MOSFET frequently asked questions and answers (REV 1.0) PDF (1.1 MB) TN00008 [English]	07 Aug 2015
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013

SPICE

BSH111BK Spice model (REV 1.0) lib BSH111BK_21_10_2014 1/27/2015

订购信息

型号	状态	Package version	Package name	Channel type	Number of transistors	V_DS [max] (V)	R_DSon [max] @ V_GS = 10 V (mΩ)	R_DSon [max] @ V_GS = 5 V (mΩ)	R_DSon [max] @ V_GS = 4.5 V (mΩ)	R_DSon [max] @ V_GS = 2.5 V (mΩ)	T_j [max] (°C)	I_D [max] (A)	Q_GD [typ] (nC)	QG(tot) [typ] @ VGS = 4.5 V (nC)	Q_G(tot) [typ] (nC)	QG(tot) [typ] @ VGS = 10 V (nC)	P_tot [max] (W)	Q_r [typ] (nC)	V_GSth [typ] (V)	Automotive qualified	C_iss [typ] (pF)	C_oss [typ] (pF)	日期
BSH111BK	Active	SOT23	TO-236AB	N	1	55			4000	5000	150	0.21	0.16	0.5	0.5		0.302		1	N	19.1	2.7	2014-11-26

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
BSH111BK		SOT23	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4	Active	BSH111BKR (9340 680 56215)	%4T	BSH111BK		Always Pb-free	234.0	1.08	9.26E8	1	1

55 V, N-channel Trench MOSFET BSH111BK

Using power MOSFETs in parallel BUK7M12-60E

LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E

Using RC Thermal Models BUK7M12-60E

LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E

LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E

LFPAK MOSFET thermal design guide BUK7M12-60E

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW

BSH111BK NXP Product Quality BSH111BK

BSH111BK NXP® Product Reliability BSH111BK

Power MOSFET frequently asked questions and answers BUK7M12-60E

BSH111BK Spice model BSH111BK

plastic surface-mounted package; 3 leads BSS84AK

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK

PMBFJ309

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