BSH111BK: 55 V, N-channel Trench MOSFET
N-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 55 V, N-channel Trench MOSFET (REV 1.0) PDF (283.0 kB) BSH111BK [English] | 26 Nov 2014 |
Application Notes (6)
| Name/Description | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English] | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English] | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
Selector Guides (2)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English] | 11 Sep 2014 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| BSH111BK NXP Product Quality (REV 1.2) PDF (74.0 kB) BSH111BK_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSH111BK NXP® Product Reliability (REV 1.1) PDF (84.0 kB) BSH111BK_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 [English] | 31 Oct 2016 |
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- BSH111BK Spice model (REV 1.0) lib BSH111BK_21_10_2014 1/27/2015
Ordering Information
| Product | Status | Package name | Package version | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSH111BK | Active | TO-236AB | SOT23 | N | 1 | 55 | 4000 | 5000 | 150 | 0.21 | 0.16 | 0.5 | 0.5 | 0.302 | 1 | N | 19.1 | 2.7 | 2014-11-26 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSH111BK | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | BSH111BKR (9340 680 56215) | %4T | BSH111BK |    | Always Pb-free | 234.0 | 1.08 | 9.26E8 | 1 | 1 |
- 55 V, N-channel Trench MOSFET BSH111BK
- Using power MOSFETs in parallel BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
- Using RC Thermal Models BUK7M12-60E
- LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- LFPAK MOSFET thermal design guide BUK7M12-60E
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
- BSH111BK NXP Product Quality BSH111BK
- BSH111BK NXP® Product Reliability BSH111BK
- Power MOSFET frequently asked questions and answers BUK7M12-60E
- BSH111BK Spice model BSH111BK
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
