BZA900A-series: 四倍ESD瞬态电压抑制器
单芯片瞬态电压抑制器二极管采用5引脚SOT665封装，可提供4位宽度的ESD瞬态抑制。
BZA900A_SERIES: 产品结构框图
sot665_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Quadruple ESD transient voltage suppressor (REV 1.0) PDF (156.0 kB) BZA900A_SERIES [English] | 03 Sep 2001 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 5 leads (REV 1.0) PDF (186.0 kB) SOT665 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (235.0 kB) SOT665_115 [English] | 03 Dec 2012 |
可靠性与质量信息 (6)
| 名称/描述 | Modified Date |
|---|---|
| BZA956A NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA956A_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BZA956A NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA956A_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BZA962A NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA962A_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BZA962A NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA962A_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BZA968A NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA968A_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BZA968A NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA968A_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- BZA956A SPICE model (REV 1.4) prm BZA956A 7/22/2012
- BZA962A SPICE model (REV 1.4) prm BZA962A 7/22/2012
- BZA968A SPICE model (REV 1.4) prm BZA968A 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BZA968A | Active |
| BZA956A | Active |
| BZA962A | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BZA968A | | SOT665 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BZA968A,115 (9340 565 31115) | Z3 | BZA968A |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
| BZA962A | | SOT665 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BZA962A,115 (9340 565 30115) | Z2 | BZA962A | | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
| BZA956A | | SOT665 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BZA956A,115 (9340 565 29115) | Z1 | BZA956A | | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- BZA956A NXP Product Quality bza956a
- BZA956A NXP® Product Reliability bza956a
- BZA962A NXP Product Quality bza962a
- BZA962A NXP® Product Reliability bza962a
- BZA968A NXP Product Quality bza968a
- BZA968A NXP® Product Reliability bza968a
- BZA956A SPICE model BZA956A
- BZA962A SPICE model BZA962A
- BZA968A SPICE model BZA968A
- plastic surface-mounted package; 5 leads pesd5v0v4uw
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4uw
- BZA900AVL_SERIES
- IP4256CZ3_M_CZ5_W_CZ6_F
