BZA900A-series: Quadruple ESD transient voltage suppressor
Monolithic transient voltage suppressor diode in a five lead SOT665 package for 4-bit wide ESD transient suppression.
BZA900A_SERIES: Product Block Diagram
sot665_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Quadruple ESD transient voltage suppressor (REV 1.0) PDF (156.0 kB) BZA900A_SERIES [English] | 03 Sep 2001 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 5 leads (REV 1.0) PDF (186.0 kB) SOT665 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (235.0 kB) SOT665_115 [English] | 03 Dec 2012 |
Reliability and Quality Information (6)
| Name/Description | Modified Date |
|---|---|
| BZA956A NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA956A_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BZA956A NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA956A_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BZA962A NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA962A_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BZA962A NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA962A_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BZA968A NXP Product Quality (REV 1.2) PDF (74.0 kB) BZA968A_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BZA968A NXP® Product Reliability (REV 1.1) PDF (83.0 kB) BZA968A_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- BZA956A SPICE model (REV 1.4) prm BZA956A 7/22/2012
- BZA962A SPICE model (REV 1.4) prm BZA962A 7/22/2012
- BZA968A SPICE model (REV 1.4) prm BZA968A 7/22/2012
Ordering Information
| Product | Status |
|---|---|
| BZA968A | Active |
| BZA956A | Active |
| BZA962A | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BZA968A | | SOT665 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BZA968A,115 (9340 565 31115) | Z3 | BZA968A |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
| BZA962A | | SOT665 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BZA962A,115 (9340 565 30115) | Z2 | BZA962A | | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
| BZA956A | | SOT665 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | BZA956A,115 (9340 565 29115) | Z1 | BZA956A | | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- BZA956A NXP Product Quality bza956a
- BZA956A NXP® Product Reliability bza956a
- BZA962A NXP Product Quality bza962a
- BZA962A NXP® Product Reliability bza962a
- BZA968A NXP Product Quality bza968a
- BZA968A NXP® Product Reliability bza968a
- BZA956A SPICE model BZA956A
- BZA962A SPICE model BZA962A
- BZA968A SPICE model BZA968A
- plastic surface-mounted package; 5 leads pesd5v0v4uw
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4uw
- BZA900AVL_SERIES
- IP4256CZ3_M_CZ5_W_CZ6_F
