PESD5V0U4BF; PESD5V0U4BW: 超低电容双向四倍ESD保护阵列

超低电容双向四倍静电放电(ESD)保护阵列采用超小型表面贴装设备(SMD)塑料封装,保护最多四路信号线免受ESD和其他瞬态电压导致的损坏。

PESD5V0U4BF_PESD5V0U4BW: 产品结构框图
PESD5V0U4BF_PESD5V0U4BW: 应用结构框图
PESD5V0U4BF_PESD5V0U4BW: 应用结构框图
PESD5V0U4BF_PESD5V0U4BW: 应用结构框图
sot665_3d
数据手册 (1)
名称/描述Modified Date
Ultra low capacitance bidirectional quadruple ESD protection arrays (REV 1.0) PDF (83.0 kB) PESD5V0U4BF_PESD5V0U4BW [English]15 Aug 2008
应用说明 (1)
名称/描述Modified Date
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
封装信息 (2)
名称/描述Modified Date
plastic surface-mounted package; 5 leads (REV 1.0) PDF (186.0 kB) SOT665 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]23 Apr 2013
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (235.0 kB) SOT665_115 [English]03 Dec 2012
可靠性与质量信息 (4)
名称/描述Modified Date
PESD5V0U4BF NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U4BF [English]31 Jan 2015
PESD5V0U4BF NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U4BF_NXP_PRODUCT_QUALITY [English]31 Jan 2015
PESD5V0U4BW NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U4BW [English]31 Jan 2015
PESD5V0U4BW NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U4BW_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
订购信息
型号状态
PESD5V0U4BWActive
PESD5V0U4BFActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD5V0U4BFSOT886Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD5V0U4BF,115 (9340 619 51115)B1PESD5V0U4BFAlways Pb-free117.00.541.85E911
PESD5V0U4BWSOT665Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD5V0U4BW,115 (9340 619 53115)A6PESD5V0U4BWAlways Pb-free117.00.541.85E911
Ultra low capacitance bidirectional quadruple ESD protection arrays pesd5v0u4bw
MicroPak soldering information NTS0102_Q100
PESD5V0U4BF NXP® Product Reliability pesd5v0u4bf
PESD5V0U4BF NXP® Product Quality pesd5v0u4bf
PESD5V0U4BW NXP® Product Reliability pesd5v0u4bw
PESD5V0U4BW NXP® Product Quality pesd5v0u4bw
MAR_SOT886 Topmark prtr5v0u2f
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f
plastic surface-mounted package; 5 leads pesd5v0v4uw
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4uw
PESD5V0U4BF_PESD5V0U4BW
PESD5V0U4BF_PESD5V0U4BW
PESD5V0U4BF_PESD5V0U4BW
PRTR5V0U2F_PRTR5V0U2K
BGU8007
IP4256CZ3_M_CZ5_W_CZ6_F