PESD5V0U4BF; PESD5V0U4BW: Ultra low capacitance bidirectional quadruple ESD protection arrays

Ultra low capacitance bidirectional quadruple ElectroStatic Discharge (ESD) protection arrays in ultra small Surface-Mounted Device (SMD) plastic packages designed to protect up to four signal lines from the damage caused by ESD and other transients.

PESD5V0U4BF_PESD5V0U4BW: Product Block Diagram
PESD5V0U4BF_PESD5V0U4BW: Block Diagram
PESD5V0U4BF_PESD5V0U4BW: Block Diagram
PESD5V0U4BF_PESD5V0U4BW: Block Diagram
sot665_3d
Data Sheets (1)
Name/DescriptionModified Date
Ultra low capacitance bidirectional quadruple ESD protection arrays (REV 1.0) PDF (83.0 kB) PESD5V0U4BF_PESD5V0U4BW [English]15 Aug 2008
Application Notes (1)
Name/DescriptionModified Date
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
Package Information (2)
Name/DescriptionModified Date
plastic surface-mounted package; 5 leads (REV 1.0) PDF (186.0 kB) SOT665 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
Packing (2)
Name/DescriptionModified Date
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]23 Apr 2013
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (235.0 kB) SOT665_115 [English]03 Dec 2012
Reliability and Quality Information (4)
Name/DescriptionModified Date
PESD5V0U4BF NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U4BF [English]31 Jan 2015
PESD5V0U4BF NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U4BF_NXP_PRODUCT_QUALITY [English]31 Jan 2015
PESD5V0U4BW NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U4BW [English]31 Jan 2015
PESD5V0U4BW NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U4BW_NXP_PRODUCT_QUALITY [English]31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
Ordering Information
ProductStatus
PESD5V0U4BWActive
PESD5V0U4BFActive
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PESD5V0U4BFSOT886Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD5V0U4BF,115 (9340 619 51115)B1PESD5V0U4BFAlways Pb-free117.00.541.85E911
PESD5V0U4BWSOT665Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD5V0U4BW,115 (9340 619 53115)A6PESD5V0U4BWAlways Pb-free117.00.541.85E911
Ultra low capacitance bidirectional quadruple ESD protection arrays pesd5v0u4bw
MicroPak soldering information NTS0102_Q100
PESD5V0U4BF NXP® Product Reliability pesd5v0u4bf
PESD5V0U4BF NXP® Product Quality pesd5v0u4bf
PESD5V0U4BW NXP® Product Reliability pesd5v0u4bw
PESD5V0U4BW NXP® Product Quality pesd5v0u4bw
MAR_SOT886 Topmark prtr5v0u2f
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f
plastic surface-mounted package; 5 leads pesd5v0v4uw
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4uw
PESD5V0U4BF_PESD5V0U4BW
PESD5V0U4BF_PESD5V0U4BW
PESD5V0U4BF_PESD5V0U4BW
PRTR5V0U2F_PRTR5V0U2K
BGU8007
IP4256CZ3_M_CZ5_W_CZ6_F