PMEG3010CEH: 1 A极低VF MEGA肖特基势垒整流二极管

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用小型扁平引脚表面贴装设备(SMD)塑料封装。

PMEG3010CEH: 产品结构框图
PMEG3010CEH: 应用结构框图
sod123f_3d
数据手册 (1)
名称/描述Modified Date
1 A very low VF MEGA Schottky barrier rectifiers (REV 2.0) PDF (70.0 kB) PMEG3010CEH_PMEG3010CEJ [English]22 Mar 2007
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (172.0 kB) SOD123F [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD123F_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PMEG3010CEH NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3010CEH [English]31 Jan 2015
PMEG3010CEH NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3010CEH_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)VR (V)ConfigurationIR [max] (mA)IFSM [max] (A)Cd [max] (pF)VF [max] (mV)
PMEG3010CEHActiveSOD123FSOD123F2.6 x 1.6 x 1.1130single0,05@VR=30V9100@VR=1V520@IF=1A
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG3010CEHSOD123FReflow_Soldering_ProfileReel 7" Q1/T1ActivePMEG3010CEH,115 (9340 610 54115)C8PMEG3010CEHAlways Pb-free157.00.731.37E911
1 A very low VF MEGA Schottky barrier rectifiers PMEG3010CEJ
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG3010CEH NXP® Product Reliability PMEG3010CEH
PMEG3010CEH NXP® Product Quality PMEG3010CEH
PMEG3010CEH SPICE model PMEG3010CEH_PMEG3010CEJ
plastic surface-mounted package; 2 leads BAT54H
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel; standard product orientation 12NC ending 115 BAT54H
1PSXSB17
1PSXSB17
NZH_SERIES