Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small and flat lead Surface-Mounted Device (SMD) plastic packages.
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1 A very low VF MEGA Schottky barrier rectifiers (REV 2.0) PDF (70.0 kB) PMEG3010CEH_PMEG3010CEJ | 22 Mar 2007 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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plastic surface-mounted package; 2 leads (REV 1.0) PDF (172.0 kB) SOD123F | 08 Feb 2016 |
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Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD123F_115 | 07 Nov 2012 |
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PMEG3010CEH NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3010CEH | 31 Jan 2015 |
PMEG3010CEH NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3010CEH_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
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PMEG3010CEH | Active | SOD123F | SOD123F | 2.6 x 1.6 x 1.1 | 1 | 30 | single | 0,05@VR=30V | 9 | 100@VR=1V | 520@IF=1A |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PMEG3010CEH | ![]() | SOD123F | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG3010CEH,115 (9340 610 54115) | C8 | PMEG3010CEH | ![]() ![]() ![]() | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |