PUMF11: NPN配电阻晶体管；PNP通用晶体管
NPN配电阻晶体管和PNP通用晶体管，采用SOT363 (SC-88)塑料封装。
SOT363
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| NPN resistor-equipped transistor; PNP general purpose transistor (REV 1.0) PDF (139.0 kB) PUMF11 [English] | 09 Apr 2002 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Application guide; Portable devices and mobile handsets (REV 2.0) PDF (15.4 MB) 75017090 [English] | 13 Mar 2012 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 [English] | 15 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PUMF11 NXP® Product Quality (REV 1.1) PDF (74.0 kB) PUMF11_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| PUMF11 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PUMF11_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 [English] | 03 Jun 2013 |
SPICE
- PUMF11 SPICE model (REV 1.4) prm PUMF11_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | channel type | Ptot (mW) | R2 (typ) (kΩ) | IC [max] (mA) | R1 (typ) (kΩ) | VCEO (V) |
|---|---|---|---|---|---|---|---|---|---|---|
| PUMF11 | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | NPN/PNP | 300 | 47 | 100 | 22 | 50 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PUMF11 | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PUMF11,115 (9340 570 51115) | R1% | PUMF11 |    | week 23, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Application guide; Portable devices and mobile handsets pesd24vs1ul
- PUMF11 NXP® Product Quality PUMF11
- PUMF11 NXP® Product Reliability PUMF11
- MAR_SOT363 Topmark BSS84AKS
- PUMF11 SPICE model PUMF11
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- BFU520Y
