NPN resistor-equipped transistor and a PNP general purpose transistor in a SOT363 (SC-88) plastic package.
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NPN resistor-equipped transistor; PNP general purpose transistor (REV 1.0) PDF (139.0 kB) PUMF11 | 09 Apr 2002 |
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Application guide; Portable devices and mobile handsets (REV 2.0) PDF (15.4 MB) 75017090 | 13 Mar 2012 |
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plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 | 08 Feb 2016 |
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TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 | 15 Nov 2012 |
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PUMF11 NXP® Product Quality (REV 1.1) PDF (74.0 kB) PUMF11_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
PUMF11 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PUMF11_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 | 03 Jun 2013 |
Product | Status | Package version | Package name | Size (mm) | channel type | Ptot (mW) | R2 (typ) (kΩ) | IC [max] (mA) | R1 (typ) (kΩ) | VCEO (V) |
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PUMF11 | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | NPN/PNP | 300 | 47 | 100 | 22 | 50 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PUMF11 | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PUMF11,115 (9340 570 51115) | R1% | PUMF11 | week 23, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |