MD7IC1812N: 1805-2170 MHz，1.3 W平均值，28 V单载波W-CDMA LDMOS宽带射频集成功率放大器
特性
| TO-270WB-14, TO-270WBG-14 Package Images |
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| MD7IC1812N, MD7IC1812GN 1805–2170 MHz, 1.3 W Avg., 28 V RF LDMOS Wideband Integrated Power Amplifiers Data Sheet (REV 0) PDF (460.0 kB) MD7IC1812N [English] | 14 May 2015 |
应用说明 (5)
| 名称/描述 | Modified Date |
|---|---|
| AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes (REV 1) PDF (112.4 kB) AN1955 [English] | 29 Apr 2014 |
| AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages (REV 3) PDF (910.7 kB) AN1907 [English] | 13 May 2009 |
| Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages (REV 0) PDF (413.2 kB) AN3789 [English] | 12 Mar 2009 |
| Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 (REV 1) PDF (111.6 kB) AN1987 [English] | 12 May 2004 |
| Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 (REV 0) PDF (112.8 kB) AN1977 [English] | 09 Oct 2003 |
工程设计要点 (1)
| 名称/描述 | Modified Date |
|---|---|
| Using Data Sheet Impedances for RF LDMOS Devices (REV 0) PDF (171.0 kB) EB212 [English] | 19 Jan 2004 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| RF Products Selector Guide (REV 43) PDF (3.8 MB) SG46 [English] | 26 May 2016 |
封装信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| 98ASA10650D, TO, 17.65x9.25x2.59, Pitch 0.36, 14 Pins (REV B) PDF (72.7 kB) 98ASA10650D [English] | 18 Mar 2016 |
| 98ASA10653D, TO, 17.6x9.3x2.59, Pitch 1.02, 14 Pins (REV B) PDF (77.4 kB) 98ASA10653D [English] | 26 Feb 2016 |
印刷电路板
- MD7IC1812N PCB DXF file (REV 2) ZIP MD7IC1812N_PCB 5/15/2015
订购信息
| 型号 | 状态 | Frequency Min (Min) (MHz) | Frequency Max (Max) (MHz) | 供电电压 (Typ) (V) | P1dB (Typ) (dBm) | P1dB (Typ) (W) | 输出功率 (Typ) (W) @ Intermodulation Level at Test Signal | 测试信号 | 功率增益 (Typ) (dB) @ f (MHz) | 效率 (Typ) (%) | 热阻 (Spec)(°C/W) | 匹配 | 类型 | 模具技术 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MD7IC1812NR1 | Active | 1805 | 2170 | 28 | 40.8 | 12 | 1.3 @ AVG | W-CDMA | 31.5 @ 1880 | 14 | 2.9 | I/O | AB | LDMOS |
| MD7IC1812GNR1 | Active | 1805 | 2170 | 28 | 40.8 | 12 | 1.3 @ AVG | W-CDMA | 31.5 @ 1880 | 14 | 2.9 | I/O | AB | LDMOS |
封装环保信息
| 封装说明 | Outline Version | 包装 | 产品状态 | 部件编号 | 化学成分 | RoHS / Pb Free中国RoHS查询 | MSL | PPT (°C) |
|---|---|---|---|---|---|---|---|---|
| TO-270 WB-14 GULL | 98ASA10653D | MPQ - 500 REELPOQ - 500 BOX | Active | MD7IC1812GNR1 | MD7IC1812GNR1.pdf |  | 3 | 260 |
| TO-270 WB-14 LEAD | 98ASA10650D | MPQ - 500 REELPOQ - 500 BOX | Active | MD7IC1812NR1 | MD7IC1812NR1.pdf | | 3 | 260 |
- AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes MMT20303H
- AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages mrf1570n
- Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages mrf1570n
- Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 MMRF2010N
- Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 MMRF2010N
- Using Data Sheet Impedances for RF LDMOS Devices mrf1570n
- RF Products Selector Guide MMT20303H
- MD7IC1812N PCB DXF file MD7IC1812N
- 98ASA10653D, TO, 17.6x9.3x2.59, Pitch 1.02, 14 Pins MMRF2010N
- MD7IC1812GNR1.pdf MD7IC1812N
- 98ASA10650D, TO, 17.65x9.25x2.59, Pitch 0.36, 14 Pins MMRF2010N
- MD7IC1812NR1.pdf MD7IC1812N
