MSC8157: MSC8157 Broadband Wireless Access DSP
The MSC8157 targets high-bandwidth highly computational DSP applications and is optimized for 3G-LTE (FDD and TDD), UMTS and WiMAX systems. The device includes a combination of fully programmable DSP cores and powerful hardware acceleration to provide best-in-class performance, power efficiency, connectivity and cost-effectiveness.
MSC8157 Broadband Wireless Access DSP Block Diagram
![MSC8157 Broadband Wireless Access DSP Block Diagram](/image/nxp/MSC8157_BD_IMG.jpg)
MSC8157 Broadband Wireless Access DSP Product Image
![MSC8157 Broadband Wireless Access DSP Product Image](/image/nxp/MSC8157_IMG.jpg)
Power Efficiency in Small Cells using NXP® Baseband Processors - Demo
![Power Efficiency in Small Cells using NXP<sup>®</sup> Baseband Processors - Demo](/image/nxp/FTF12NET_958_VID.jpg)
特性
- Core frequency 1 GHz operating at up to 48000 MMACS with six SC3850 cores. The core subsystems support several large areas of memory/cache, a memory controller and interrupt controller
- CLASS high-speed non-blocking interconnect fabric to provide optimal throughput between all internal device blocks
- The MAPLE-B2 supports Turbo decoding including rate matching supporting up to 330 Mb/s for 3GLTE, up to 300 Mb/s for WiMAX and up to 260 Mbps in UMTS at eight full iterations; Turbo encoding: information bits encoding including rate matching up to 900 Mbps for 3GLTE and WiMAX and up to 450 Mbps for UMTS; Viterbi decoding up to 200 Mbps for K=9, zero tailing and up to 175 Mbps for K=7 tail biting; FFT/iFFT processing supporting up to 960 Msps; DFT/iDFT processing supporting up to 630 Msps; CRC check and insertion supporting up to 10 Gbps.
- DMA controller with 16 bidirectional channel pairs
- Internal data profiling for optimizing data throughput during development
- Dual RISC core QUICC Engine® subsystem supporting two SGMII/RGMII ports and serial peripheral interface (SPI)
- HSSI complex with OCN fabric, two 4-channel DMA controllers, two Serial RapidIO® ports, an enhanced messaging unit and 10 SerDes lanes multiplexing two Serial RapidIO x4/x2/x1 interfaces up to five Gbaud, PCI Express® x4/x2/x1 interface, six CPRI channels, and two SGMIIs.
- Eight programmable hardware semaphores to manage resources
- Other serial interfaces: UART, timers, I²C, GPIO, interrupts and JTAG
- Power supplies: Core power: 1-volt nominal, I/O power, 1.0-volt, 1.5-volt and 2.5-volt nominal
- Flip chip-plastic ball grid array (FC-PBGA), 783-ball, 1 mm pitch, 29 mm × 29 mm.
- Optional security engine (E version only) to provide data encryption/decryption capability. Supports Kasumi f8/f9, AES-128 and AES-256, SNOW and other protocols.
Recommended Documentation (1)
Data Sheets (2)
Application Notes (15)
Reference Manuals (5)
Product Briefs (2)
Engineering Bulletins (1)
Fact Sheets (1)
Brochures (1)
订购信息
型号 | 状态 | 预算报价(不含税)(CNY) | 封装类型和焊端数 | Core Type | 工作频率 (Max) (MHz) | 内核:内核数量 (Spec) | 工作环境温度 (Min-Max) (°C) | 缓存 (KB) | L2缓存 (Max) (KB) | 内部RAM (KB) | 支持外部存储器 | DMA通道总数 | Ethernet Type | 其他特性 |
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MSC8157TAG1000A | Not Recommended for New Design | 1K @ CNY1,093.91 | FCPBGA 783 | SC3850 | 1000 | 6 | -45 to 105 | 32 | 512 | | DDR, SDRAM | 16 | 1GBaseT, SGMII | |
MSC8157ETAG1000A | Not Recommended for New Design | 1K @ CNY1,109.25 | FCPBGA 783 | SC3850 | 1000 | 6 | -45 to 105 | 32 | 512 | | DDR, SDRAM | 16 | 1GBaseT, SGMII | |
MSC8157ESAG1000A | Not Recommended for New Design | 1K @ CNY1,034.41 | FCPBGA 783 | SC3850 | 1000 | 6 | 0 to 105 | 32 | 512 | | DDR, SDRAM | 16 | 1GBaseT, SGMII | |
MSC8157SAG1000A | Not Recommended for New Design | 1K @ CNY976.08 | FCPBGA 783 | SC3850 | 1000 | 6 | 0 to 105 | 32 | 512 | | DDR, SDRAM | 16 | 1GBaseT, SGMII | |
MSC8157ETVT1200A | No Longer Manufactured | | FCBGA 783 | SC3850 | 1200 | 6 | -45 to 105 | 32 | 512 | | DDR, SDRAM | 16 | 1GBaseT, SGMII | |
MSC8157ETVT1000A | No Longer Manufactured | | FCPBGA 783 | SC3850 | 1000 | 6 | -45 to 105 | 32 | 512 | | DDR, SDRAM | 16 | 1GBaseT, SGMII | |
MSC8157TVT1000A | No Longer Manufactured | | FCPBGA 783 | SC3850 | 1000 | 6 | -45 to 105 | 32 | 512 | | DDR, SDRAM | 16 | 1GBaseT, SGMII | |
MSC8157ESVT1000A | No Longer Manufactured | | FCPBGA 783 | SC3850 | 1000 | 6 | 0 to 105 | 32 | 512 | | DDR, SDRAM | 16 | 1GBaseT, SGMII | |
MSC8157SVT1000A | No Longer Manufactured | | FCPBGA 783 | SC3850 | 1000 | 6 | 0 to 105 | 32 | 512 | | DDR, SDRAM | 16 | 1GBaseT, SGMII | |
封装环保信息