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MSC8157: MSC8157 Broadband Wireless Access DSP

The MSC8157 targets high-bandwidth highly computational DSP applications and is optimized for 3G-LTE (FDD and TDD), UMTS and WiMAX systems. The device includes a combination of fully programmable DSP cores and powerful hardware acceleration to provide best-in-class performance, power efficiency, connectivity and cost-effectiveness.

MSC8157 Broadband Wireless Access DSP Block Diagram

MSC8157 Broadband Wireless Access DSP Product Image

Power Efficiency in Small Cells using NXP^® Baseband Processors - Demo

特性

• Core frequency 1 GHz operating at up to 48000 MMACS with six SC3850 cores. The core subsystems support several large areas of memory/cache, a memory controller and interrupt controller
• CLASS high-speed non-blocking interconnect fabric to provide optimal throughput between all internal device blocks
• The MAPLE-B2 supports Turbo decoding including rate matching supporting up to 330 Mb/s for 3GLTE, up to 300 Mb/s for WiMAX and up to 260 Mbps in UMTS at eight full iterations; Turbo encoding: information bits encoding including rate matching up to 900 Mbps for 3GLTE and WiMAX and up to 450 Mbps for UMTS; Viterbi decoding up to 200 Mbps for K=9, zero tailing and up to 175 Mbps for K=7 tail biting; FFT/iFFT processing supporting up to 960 Msps; DFT/iDFT processing supporting up to 630 Msps; CRC check and insertion supporting up to 10 Gbps.
• DMA controller with 16 bidirectional channel pairs
• Internal data profiling for optimizing data throughput during development
• Dual RISC core QUICC Engine® subsystem supporting two SGMII/RGMII ports and serial peripheral interface (SPI)
• HSSI complex with OCN fabric, two 4-channel DMA controllers, two Serial RapidIO® ports, an enhanced messaging unit and 10 SerDes lanes multiplexing two Serial RapidIO x4/x2/x1 interfaces up to five Gbaud, PCI Express® x4/x2/x1 interface, six CPRI channels, and two SGMIIs.
• Eight programmable hardware semaphores to manage resources
• Other serial interfaces: UART, timers, I²C, GPIO, interrupts and JTAG
• Power supplies: Core power: 1-volt nominal, I/O power, 1.0-volt, 1.5-volt and 2.5-volt nominal
• Flip chip-plastic ball grid array (FC-PBGA), 783-ball, 1 mm pitch, 29 mm × 29 mm.
• Optional security engine (E version only) to provide data encryption/decryption capability. Supports Kasumi f8/f9, AES-128 and AES-256, SNOW and other protocols.

Recommended Documentation (1)

Data Sheets (2)

Application Notes (15)

Reference Manuals (5)

Product Briefs (2)

Engineering Bulletins (1)

Fact Sheets (1)

Brochures (1)

Ordering Information

Package Information

Package Description	Outline Version	Packing	Product Status	Part Number	Chemical Content	RoHS / Pb FreeChina RoHS Lookup	MSL	PPT (°C)
FCPBGA 783 29SQ3.55P1.0	98ARE10738D	MPQ - 1 EACHPOQ - 180 BOX	Not Recommended for New Design	MSC8157SAG1000A	MSC8157SAG1000A.pdf		3	245
		MPQ - 36 TRAYPOQ - 180 BOX	Not Recommended for New Design	MSC8157TAG1000A	MSC8157TAG1000A.pdf		3	245
		MPQ - 180 BRICKPOQ - 180 BOX	Not Recommended for New Design	MSC8157ESAG1000A	MSC8157ESAG1000A.pdf		3	245
		MPQ - 36 TRAYPOQ - 180 BOX	Not Recommended for New Design	MSC8157ETAG1000A	MSC8157ETAG1000A.pdf		3	245
			No Longer Manufactured	MSC8157ESVT1000A	MSC8157ESVT1000A.pdf		3	245
			No Longer Manufactured	MSC8157ETVT1000A	MSC8157ETVT1000A.pdf		3	245
			No Longer Manufactured	MSC8157ETVT1200A	MSC8157ETVT1200A.pdf		3	245
			No Longer Manufactured	MSC8157SVT1000A	MSC8157SVT1000A.pdf		3	245
			No Longer Manufactured	MSC8157TVT1000A	MSC8157TVT1000A.pdf		3	245