RB520S30: 200 mA低Vf MEGA肖特基势垒整流器
平面高能效通用型(MEGA)肖特基势垒整流器，带集成应力保护环，采用SOD523 (SC-79)超小型扁平引脚表面贴装器件（SMD）塑料封装。
RB520S30: 产品结构框图
RB520S30: 应用结构框图
sod523_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 200 mA low Vf MEGA Schottky barrier rectifier (REV 1.0) PDF (244.0 kB) RB520S30 [English] | 08 Oct 2009 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD523 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_115 [English] | 07 Nov 2012 |
| Tape reel; standard product orientation 12NC ending 315 (REV 1.0) PDF (179.0 kB) SOD523_315 [English] | 07 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| RB520S30 NXP Product Quality (REV 1.2) PDF (74.0 kB) RB520S30_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| RB520S30 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) RB520S30_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- RB520S30 SPICE model (REV 1.4) prm RB520S30_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RB520S30 | Active | SOD523 | SOD523 | 1.2 x 0.8 x 0.6 | 1@VR=10V | single | 600@IF=200mA | 1 | 20@VR=1V | 30 | 200 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RB520S30 | | SOD523 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | RB520S30YL (9340 639 54315) | ZA | RB520S30 |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | RB520S30,115 (9340 639 54115) | ZA | RB520S30 | | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- RB520S30 NXP Product Quality RB520S30
- RB520S30 NXP® Product Reliability RB520S30
- RB520S30 SPICE model RB520S30
- plastic surface-mounted package; 2 leads pesd5z7.0
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 315 pesd5v0u1bb
- Tape reel; standard product orientation 12NC ending 115 pesd5z7.0
- 1PSXSB17
- BB208-02
